the bond pad being disposed in a recess of the surface of the item

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H01L2224/40248

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40248the bond pad being disposed in a recess of the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Stacked dual-chip packaging structure and preparation method thereof
- Patent number 9,184,117
- Issue date Nov 10, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation method
- Patent number 8,722,468
- Issue date May 13, 2014
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation and method thereof
- Patent number 8,519,525
- Issue date Aug 27, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ENCAPSULATION METHOD
- Publication number 20130309816
- Publication date Nov 21, 2013
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ENCAPSULATION AND METHOD THEREOF
- Publication number 20120025360
- Publication date Feb 2, 2012
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS