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the bond pad being disposed in a recess of the surface of the item

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  • CPC
  • H01L2224/40228
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40228the bond pad being disposed in a recess of the surface of the item
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  • Information Patent Application

    VARIABLE STIFFNESS MODULES
    • Publication number 20220285309
    • Publication date Sep 8, 2022
    • X-CELEPRINT LIMITED
    • Ronald S. Cok
    • H01 - BASIC ELECTRIC ELEMENTS