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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48229the bond pad protruding from the surface of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,051,636
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,015,048
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Joo Woan Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic sense amplifier supply voltage for power and die size reduc...
- Patent number 11,978,516
- Issue date May 7, 2024
- SANDISK TECHNOLOGIES LLC
- Yanjie Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 11,935,602
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,929,351
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and test method of semiconductor device
- Patent number 11,892,503
- Issue date Feb 6, 2024
- Toshiba Tec Kabushiki Kaisha
- Takuya Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit power delivery
- Patent number 11,817,394
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method of forming the same
- Patent number 11,810,849
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmitter component, receiver component, transceiver circuit, and...
- Patent number 11,791,536
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Wolfgang Scherr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package
- Patent number 11,735,510
- Issue date Aug 22, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated half-bridge power converter
- Patent number 11,715,720
- Issue date Aug 1, 2023
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields with bonding wires for sub-modules
- Patent number 11,515,282
- Issue date Nov 29, 2022
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,476,226
- Issue date Oct 18, 2022
- Murata Manufacturing Co., Ltd.
- Takanori Uejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method of forming the same
- Patent number 11,437,310
- Issue date Sep 6, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,367,664
- Issue date Jun 21, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,335,768
- Issue date May 17, 2022
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 11,309,275
- Issue date Apr 19, 2022
- KINGPAK TECHNOLOGY INC.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,282,811
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with terminal pattern for increased channel d...
- Patent number 11,211,315
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive element, laminate, permanent mask resist, method for...
- Patent number 11,054,744
- Issue date Jul 6, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Toshimasa Nagoshi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 10,964,673
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20240347498
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Daesik MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240339489
- Publication date Oct 10, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joo Woan CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND CHIP
- Publication number 20240321828
- Publication date Sep 26, 2024
- ALi Corporation
- Liang-Cai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...
- Publication number 20240304575
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- ZZU-CHI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20240234355
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT
- Publication number 20240233836
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203942
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Doyoung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20240194640
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SEONGHO YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20240178121
- Publication date May 30, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyehwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170456
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Seo Eun KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20240162132
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Kwangsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package Assembly Containing A Decoupling Capacitor
- Publication number 20240145452
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240128157
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240120300
- Publication date Apr 11, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113074
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Heewoo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20240096792
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS

the bond pad protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module with graphite plate

Power module

Display device

Dynamic sense amplifier supply voltage for power and die size reduc...

Integrated high voltage capacitor

Semiconductor device package comprising a pin in the form of a dril...

Power management

Integrated circuit wire bonded to a multi-layer substrate having an...

Semiconductor device and test method of semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor package having an encapsulant comprising conductive f...

Semiconductor circuit power delivery

Connection structure and method of forming the same

Transmitter component, receiver component, transceiver circuit, and...

Printed circuit board and electronic component package

Integrated half-bridge power converter

Electromagnetic shields with bonding wires for sub-modules

Jointing material, fabrication method for semiconductor device usin...

Radio-frequency module and communication device

Connection structure and method of forming the same

Semiconductor devices and methods of manufacturing semiconductor de...

Bottom package exposed die MEMS pressure sensor integrated circuit...

Semiconductor packages and methods of forming same

Integrated high voltage capacitor

Sensor package structure

Semiconductor device structure and method for forming the same

Integrated circuit wire bonded to a multi-layer substrate having an...

Semiconductor package with terminal pattern for increased channel d...

Photosensitive element, laminate, permanent mask resist, method for...

Semiconductor device and manufacturing method of the same

Patents Applicationslast 30 patents

Semiconductor Device and Method

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

THERMALLY REGULATED SEMICONDUCTOR DEVICE

MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

DISPLAY DEVICE

INTEGRATED CIRCUIT STRUCTURE AND CHIP

BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

MODULE

POWER MANAGEMENT

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

SEMICONDUCTOR PACKAGE

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLU...

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

FAN-OUT SEMICONDUCTOR PACKAGE

Package-On-Package Assembly Containing A Decoupling Capacitor

Semiconductor Package and Method of Manufacturing the Same

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

CHIP PACKAGE

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

SEMICONDUCTOR PACKAGE

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...