TREA

the bond pad protruding from the surface of the item

Follow

Industry

  • CPC
  • H01L2224/40159
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40159the bond pad protruding from the surface of the item
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module
    • Patent number 9,397,030
    • Issue date Jul 19, 2016
    • NSK Ltd.
    • Takashi Sunaga
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS

Patents Applicationslast 30 patents