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CPC
H01L2224/48159

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48159the bond pad protruding from the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multirow gull-wing package for microelectronic devices
- Patent number 11,335,570
- Issue date May 17, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line
- Patent number 10,937,759
- Issue date Mar 2, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile device with radio frequency transmission line
- Patent number 10,529,686
- Issue date Jan 7, 2020
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,887,154
- Issue date Feb 6, 2018
- Mitsubishi Electric Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,768,100
- Issue date Sep 19, 2017
- Kabushiki Kaisha Toshiba
- Hiroshi Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line for high performance radio frequency applications
- Patent number 9,679,869
- Issue date Jun 13, 2017
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 8,450,848
- Issue date May 28, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379574
- Publication date Nov 14, 2024
- Rohm Co., Ltd.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105578
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230052793
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hae Yun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20220277965
- Publication date Sep 1, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20200203184
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...
- Publication number 20170301647
- Publication date Oct 19, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271303
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271301
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE DEVICE WITH RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271302
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170256483
- Publication date Sep 7, 2017
- Kabushiki Kaisha Toshiba
- Hiroshi Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallized electric component
- Publication number 20160056121
- Publication date Feb 25, 2016
- INFINEON TECHNOLOGIES AG
- Joachim MAHLER
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140091462
- Publication date Apr 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE FOR HIGH PERFORMANCE RADIO FREQUENCY APPLICATIONS
- Publication number 20130057451
- Publication date Mar 7, 2013
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100148362
- Publication date Jun 17, 2010
- Panasonic Corparation
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS

the bond pad protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radio frequency transmission line with finish plating on conductive...

Multirow gull-wing package for microelectronic devices

Radio frequency transmission line

Mobile device with radio frequency transmission line

Fan-out semiconductor package

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device

Transmission line for high performance radio frequency applications

Semiconductor device and method for fabricating the same

Chip package with plank stack of semiconductor dies

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DISPLAY DEVICE

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

FAN-OUT SEMICONDUCTOR PACKAGE

RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...

DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE

RADIO FREQUENCY TRANSMISSION LINE

MOBILE DEVICE WITH RADIO FREQUENCY TRANSMISSION LINE

SEMICONDUCTOR DEVICE

Metallized electric component

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

TRANSMISSION LINE FOR HIGH PERFORMANCE RADIO FREQUENCY APPLICATIONS

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME