the bond pad protruding from the surface of the item

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H01L2224/48179

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48179the bond pad protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming partition fence and shie...
- Patent number 10,418,332
- Issue date Sep 17, 2019
- STATS ChipPAC Pte. Ltd.
- Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,388,637
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079291
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243039
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS