the bonding area connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

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H01L2224/08151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08151the bonding area connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulating resin
- Patent number 10,784,177
- Issue date Sep 22, 2020
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE INCLUDING COMPOSITE INTERPOSER AND/OR COMPOSITE PACKAGING S...
- Publication number 20240222287
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS