the bonding area connecting between different semiconductor or solid-state bodies

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H01L2224/08135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08135the bonding area connecting between different semiconductor or solid-state bodies

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Patents Grantslast 30 patents

Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system including the same
- Patent number 12,009,325
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Sung-Min Hwang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,923,302
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 11,756,842
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 11,488,998
- Issue date Nov 1, 2022
- Canon Kabushiki Kaisha
- Akihiro Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,410,929
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulating resin
- Patent number 10,784,177
- Issue date Sep 22, 2020
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die interface configuration and methods of use thereof
- Patent number 10,424,921
- Issue date Sep 24, 2019
- QUALCOMM Incorporated
- Kenneth Dubowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure for three-dimensional semiconductor device
- Patent number 9,698,080
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive alignment of polymer waveguides
- Patent number 9,671,577
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Roger F. Dangel
- G02 - OPTICS
Information Patent Grant
Semiconductor device, imaging device and semiconductor device manuf...
- Patent number 9,343,498
- Issue date May 17, 2016
- Olympus Corporation
- Haruhisa Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 8,134,235
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240312937
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Sung-Min Hwang
- G11 - INFORMATION STORAGE
Information Patent Application
CAP LAYER FOR PAD OXIDATION PREVENTION
- Publication number 20240243080
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240105619
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20230326815
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20220336299
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220336356
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20220139855
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Sung-Min HWANG
- G11 - INFORMATION STORAGE
Information Patent Application
Die-to-Die Interface Configuration and Methods of Use Thereof
- Publication number 20180233907
- Publication date Aug 16, 2018
- QUALCOMM Incorporated
- Kenneth Dubowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device
- Publication number 20150380341
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, IMAGING DEVICE AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20150270304
- Publication date Sep 24, 2015
- OLYMPUS CORPORATION
- Haruhisa Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device
- Publication number 20120164789
- Publication date Jun 28, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional semiconductor device
- Publication number 20080258309
- Publication date Oct 23, 2008
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting between different semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Daisy-chain seal ring structure

Semiconductor device and electronic system including the same

Semiconductor device and method of manufacture

Daisy-chain seal ring structure

Semiconductor apparatus and equipment

Semiconductor device and method of manufacture

Semiconductor packages including routing dies and methods of formin...

Semiconductor device with encapsulating resin

Die-to-die interface configuration and methods of use thereof

Conductor structure for three-dimensional semiconductor device

Passive alignment of polymer waveguides

Semiconductor device, imaging device and semiconductor device manuf...

Three-dimensional semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

CAP LAYER FOR PAD OXIDATION PREVENTION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE

DAISY-CHAIN SEAL RING STRUCTURE

DAISY-CHAIN SEAL RING STRUCTURE

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Die-to-Die Interface Configuration and Methods of Use Thereof

Three-Dimensional Semiconductor Device

SEMICONDUCTOR DEVICE, IMAGING DEVICE AND SEMICONDUCTOR DEVICE MANUF...

Three-Dimensional Semiconductor Device

Three-dimensional semiconductor device