the bonding area connecting to a bonding area disposed in a recess of the surface of the item

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H01L2224/08167

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08167the bonding area connecting to a bonding area disposed in a recess of the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package fan out stacking architecture and process flow
- Patent number 9,633,974
- Issue date Apr 25, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20210098411
- Publication date Apr 1, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS