the bonding area connecting to a bonding area protruding from the surface of the item

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H01L2224/08268

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08268the bonding area connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,793,234
- Issue date Oct 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with printed sensor
- Patent number 9,646,906
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315061
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRINTED SENSOR
- Publication number 20160093548
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS