the bonding area connecting to a bonding area protruding from the surface of the item

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H01L2224/08168

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08168the bonding area connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Vertical chip interposer and method of making a chip assembly conta...
- Patent number 10,700,028
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device having a stacked die block
- Patent number 10,325,881
- Issue date Jun 18, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies formed using metal silicide, and methods...
- Patent number 9,905,523
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip device including a substrate
- Patent number 9,385,107
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-E...
- Publication number 20240194575
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seungryong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CHIP INTERPOSER AND METHOD OF MAKING A CHIP ASSEMBLY CONTA...
- Publication number 20190252361
- Publication date Aug 15, 2019
- SanDisk Technologies LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS...
- Publication number 20170018517
- Publication date Jan 19, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE
- Publication number 20140063767
- Publication date Mar 6, 2014
- Sanyo Electric Co., Ltd.
- Kouichi SAITOU
- H01 - BASIC ELECTRIC ELEMENTS