the bonding area connecting to a bonding area protruding from the surface of the item

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H01L2224/08258

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08258the bonding area connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a semiconductor flip-chip package
- Patent number 11,393,742
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,741,415
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243106
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Flip-Chip Package
- Publication number 20200388561
- Publication date Dec 10, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE INCLUDING FAN-OUT MEMO...
- Publication number 20160329298
- Publication date Nov 10, 2016
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS