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the bonding area connecting to a potential ring of the item
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CPC
H01L2224/08253
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/08253
the bonding area connecting to a potential ring of the item
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Patent Application
SEALING RING, STACKED STRUCTURE, AND METHOD FOR MANUFACTURING SEALI...
Publication number
20230140743
Publication date
May 4, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Hua Hu
H01 - BASIC ELECTRIC ELEMENTS