the bonding area connecting to a potential ring of the item

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H01L2224/08233

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08233the bonding area connecting to a potential ring of the item

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Patents Grantslast 30 patents

Information Patent Grant
Chip and manufacturing method thereof, and electronic device
- Patent number 11,862,529
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20220102237
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS