the bonding area connecting to a via connection in the body

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H01L2224/08146

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08146the bonding area connecting to a via connection in the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,362,344
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including two or more stacked semiconductor st...
- Patent number 12,354,984
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Choung Ki Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,355,003
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Seungyoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,355,007
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 12,347,819
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having penetration vias
- Patent number 12,347,781
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including interconnect-level bonding pads and metho...
- Patent number 12,347,804
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the semiconduct...
- Patent number 12,300,671
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective semiconductor elements for bonded structures
- Patent number 12,300,634
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer seal ring having protrusion extending into tren...
- Patent number 12,278,151
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,278,211
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,272,676
- Issue date Apr 8, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for forming the same
- Patent number 12,261,137
- Issue date Mar 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including substrates bonded to each other and...
- Patent number 12,255,126
- Issue date Mar 18, 2025
- SK hynix Inc.
- Mi Seon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, semiconductor device comprising grating coupler...
- Patent number 12,243,860
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
- Publication number 20250233086
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250226339
- Publication date Jul 10, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20250224556
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226361
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Dawoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226355
- Publication date Jul 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250219016
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER SEAL RING
- Publication number 20250210427
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250210595
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE
- Publication number 20250210583
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250210558
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Nobuhiko HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BALANCING CLOCK SKEW IN STACKED SEMICONDUCTOR DEVICES
- Publication number 20250211215
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Shravan Lakshman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
- Publication number 20250210469
- Publication date Jun 26, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE
- Publication number 20250210497
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPACKAGING STRUCTURE
- Publication number 20250210498
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Shih-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
- Publication number 20250201768
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES FOR HIGH CAPAC...
- Publication number 20250201793
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL LINES FOR SEMICONDUCTOR DEVICES
- Publication number 20250201693
- Publication date Jun 19, 2025
- Altera Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250201745
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Yiyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201650
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201726
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20250203893
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...
- Publication number 20250192099
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Ashish Alawani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE
- Publication number 20250192127
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Dong Joo CHOI
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a via connection in the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Semiconductor package and method of manufacturing the same

Semiconductor device including two or more stacked semiconductor st...

Semiconductor devices and data storage systems including the same

Package and method of fabricating the same

Semiconductor package having stacked semiconductor chips

Semiconductor devices having penetration vias

Bonded assembly including interconnect-level bonding pads and metho...

Semiconductor chip including through electrode, and semiconductor p...

Interconnection structure of a semiconductor chip having pads of di...

Semiconductor die, manufacturing method thereof, and semiconductor...

Seamless bonding layers in semiconductor packages and methods of fo...

Semiconductor packages and methods of manufacturing the semiconduct...

Protective semiconductor elements for bonded structures

Fan-out semiconductor package

Semiconductor structure and manufacturing method thereof

Semiconductor wafer seal ring having protrusion extending into tren...

Manufacturing method of semiconductor device

Memory device

Three-dimensional device structure including substrate-embedded int...

Integrated circuit packages

Bonding structure and method for forming the same

Semiconductor device with composite conductive features and method...

Bond pads for semiconductor die assemblies and associated methods a...

Stacked semiconductor device

Structure and method for isolation of bit-line drivers for a three-...

Semiconductor devices including substrates bonded to each other and...

Die-group package having a deep trench device

Semiconductor device including penetration via structure

Package structure, semiconductor device comprising grating coupler...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE

PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER SEAL RING

MEMORY DEVICE

DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS OF BALANCING CLOCK SKEW IN STACKED SEMICONDUCTOR DEVICES

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

REPACKAGING STRUCTURE

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES FOR HIGH CAPAC...

SIGNAL LINES FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

3D STACK PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...

SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE