the bonding area connecting to a via connection in the body

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H01L2224/08146

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08146the bonding area connecting to a via connection in the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts, and comp...
- Patent number 11,961,820
- Issue date Apr 16, 2024
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pads over TSV
- Patent number 11,955,445
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,948,919
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with vertically offset bondin...
- Patent number 11,942,444
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,942,454
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages having through vias
- Patent number 11,923,351
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Daeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,923,302
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,887,968
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having adjoined via structures formed by bond...
- Patent number 11,887,954
- Issue date Jan 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,876,077
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 11,869,573
- Issue date Jan 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuliang Ning
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip stack packaging structure and chip stack packaging method
- Patent number 11,869,872
- Issue date Jan 9, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die circuit routing system and method
- Patent number 11,869,874
- Issue date Jan 9, 2024
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,862,604
- Issue date Jan 2, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,613
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 11,855,130
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with through substrate vias and manufacturi...
- Patent number 11,855,021
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,842,979
- Issue date Dec 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,837,579
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,045
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Junghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stacked dies
- Patent number 11,824,047
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128174
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH CONNECTIVITY ST...
- Publication number 20240120320
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
- Publication number 20240113070
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- CHINTAN BUCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
- Publication number 20240105680
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240105619
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105679
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096831
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Enbin Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
- Publication number 20240088084
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Ameen D. Akel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240087987
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240072093
- Publication date Feb 29, 2024
- Sony Semiconductor Solutions Corporation
- SHINICHI MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240071951
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...
- Publication number 20240072028
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20240071942
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Young kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20240071969
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20240063206
- Publication date Feb 22, 2024
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063151
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240063078
- Publication date Feb 22, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063153
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063160
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240055390
- Publication date Feb 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240047343
- Publication date Feb 8, 2024
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240047395
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240047365
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240038731
- Publication date Feb 1, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240038732
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240030083
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE STACKED SEMICONDUCTOR ST...
- Publication number 20240021553
- Publication date Jan 18, 2024
- SK HYNIX INC.
- Choung Ki SONG
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a via connection in the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and electronic systems including the same

Method for producing a connection between component parts, and comp...

Metal pads over TSV

Stacked semiconductor package

Bonded assembly including an airgap containing bonding-level dielec...

Stacked semiconductor package

Semiconductor interconnect structures with vertically offset bondin...

Package and manufacturing method thereof

Stacked-chip packages having through vias

Semiconductor device and method of manufacture

Multi-metal contact structure

Interconnect structures and methods of fabrication

Method of manufacturing a semiconductor package

Semiconductor devices having adjoined via structures formed by bond...

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device and method of manufacturing the same

Bonding alignment marks at bonding interface

Semiconductor memory

Chip stack packaging structure and chip stack packaging method

Stacked die circuit routing system and method

Systems and methods for releveled bump planes for chiplets

Semiconductor package

Three-dimensional device structure including substrate-embedded int...

Offset-aligned three-dimensional integrated circuit

Semiconductor structure with through substrate vias and manufacturi...

Integrated circuit package and method

Semiconductor device and method of manufacturing the same

Semiconductor structure

Semiconductor package and method of manufacturing the semiconductor...

Method for fabricating semiconductor device with stacked dies

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH CONNECTIVITY ST...

INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...

SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE

Integrated Circuit Package and Method

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...

SEMICONDUCTOR STRUCTURE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

MEMORY DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE STACKED SEMICONDUCTOR ST...