the bonding area connecting to a via metallisation of the item

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H01L2224/08235

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08235the bonding area connecting to a via metallisation of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,305
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor module
- Patent number 12,087,740
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,062,617
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including reinforcement pattern
- Patent number 12,033,961
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Joongsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,009,350
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 11,996,378
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,978,695
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,978,696
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having porous dielectric layer
- Patent number 11,973,017
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,967,549
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,916,002
- Issue date Feb 27, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for collectively bending microelectronic components using s...
- Patent number 11,908,832
- Issue date Feb 20, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Alexis Rochas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,336
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including conductive crack preventing layer
- Patent number 11,862,581
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,817,430
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,791,230
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,791,243
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-type component carrier and method of manufacturing the same
- Patent number 11,784,132
- Issue date Oct 10, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,764,166
- Issue date Sep 19, 2023
- Industrial Technology Research Institute
- Jui-Wen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 11,764,177
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and method for manufacturing the same
- Patent number 11,621,220
- Issue date Apr 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,594,524
- Issue date Feb 28, 2023
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,569,175
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package containing device dies and interconnect die and redistribut...
- Patent number 11,532,585
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective structure and method of fabricati...
- Patent number 11,532,598
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming a Semiconductor Module
- Publication number 20240413127
- Publication date Dec 12, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240395720
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240379515
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Kyoungok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240363542
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355802
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240332268
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...
- Publication number 20240321709
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20240290739
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290762
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...
- Publication number 20240282723
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER
- Publication number 20240282693
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240274581
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Dohoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240266269
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240258302
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234275
- Publication date Jul 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Hui Yeong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234374
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234402
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH INTERCONNECT STRUCTURE
- Publication number 20240234353
- Publication date Jul 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY DEVICE PACKAGES
- Publication number 20240213188
- Publication date Jun 27, 2024
- Analog Devices, Inc.
- Santosh Anil Kudtarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240194582
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seokkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a via metallisation of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor package unit of surface mount technology includ...

Semiconductor package

Method of forming a semiconductor module

3D integrations and methods of making thereof

Semiconductor package

Semiconductor package including reinforcement pattern

Semiconductor package and method of fabricating the same

Semiconductor package and method for manufacturing semiconductor pa...

Semiconductor package and method of fabricating the same

Encapsulated package including device dies connected via interconne...

Semiconductor package device

Package substrate having porous dielectric layer

Semiconductor package

Semiconductor package

Process for collectively bending microelectronic components using s...

Semiconductor package

Semiconductor package including conductive crack preventing layer

Semiconductor module

Fan-out semiconductor package

Semiconductor device and method of manufacture

Interposer-type component carrier and method of manufacturing the same

Semiconductor package structure

Bonded structure with interconnect structure

Electromigration resistant and profile consistent contact arrays

Assembly structure and method for manufacturing the same

Fabrication and use of through silicon vias on double sided interco...

Semiconductor package

Cavity structures in integrated circuit package supports

Package containing device dies and interconnect die and redistribut...

Package structure with protective structure and method of fabricati...

Patents Applicationslast 30 patents

Method of Forming a Semiconductor Module

SEMICONDUCTOR PACKAGE

PACKAGE BODY AND PREPARATION METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Package and Method of Manufacturing the Same

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...

PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

BONDED STRUCTURE WITH INTERCONNECT STRUCTURE

HIGH FREQUENCY DEVICE PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME