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Electronic package
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Patent number 12,308,308
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Issue date May 20, 2025
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Siliconware Precision Industries Co., Ltd.
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Sung-Hua Chung
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,237,252
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Issue date Feb 25, 2025
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Samsung Electronics Co., Ltd.
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Yoonyoung Jeon
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,237,308
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Issue date Feb 25, 2025
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Samsung Electronics Co., Ltd.
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Hyuekjae Lee
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,183,665
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Issue date Dec 31, 2024
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Samsung Electronics Co., Ltd.
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Myungsam Kang
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,119,305
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Issue date Oct 15, 2024
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Samsung Electronics Co., Ltd.
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Kyungdon Mun
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,062,617
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Issue date Aug 13, 2024
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Samsung Electronics Co., Ltd.
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Joonsung Kim
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package device
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Patent number 11,978,696
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Issue date May 7, 2024
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Samsung Electronics Co., Ltd.
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Gyujin Choi
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,967,549
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Issue date Apr 23, 2024
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Samsung Electronics Co., Ltd.
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Jung Ho Park
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,916,002
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Issue date Feb 27, 2024
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Samsung Electronics Co., Ltd.
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Myungsam Kang
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,901,336
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Issue date Feb 13, 2024
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Samsung Electronics Co., Ltd.
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Hyuekjae Lee
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor module
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Patent number 11,817,430
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Issue date Nov 14, 2023
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Infineon Technologies Austria AG
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Angela Kessler
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H01 - BASIC ELECTRIC ELEMENTS
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Fan-out semiconductor package
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Patent number 11,791,230
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Issue date Oct 17, 2023
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Samsung Electronics Co., Ltd.
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Joonsung Kim
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H01 - BASIC ELECTRIC ELEMENTS
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