the bonding areas being at different heights

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06102the bonding areas being at different heights

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Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,300,772
- Issue date May 13, 2025
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
- Patent number 12,154,879
- Issue date Nov 26, 2024
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
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- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
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- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
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- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
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- Issue date Aug 29, 2023
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- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
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- Issue date Jul 25, 2023
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- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having side surface connection pads
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- Issue date Jul 18, 2023
- Samsung Display Co., Ltd.
- Jinseon Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
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- Issue date Jan 31, 2023
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- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving reliability
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- Yeohoon Yoon
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Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
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- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
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Information Patent Grant
3D package configuration
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- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure having dummy pad disposed between inpu...
- Patent number 11,367,710
- Issue date Jun 21, 2022
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure having dummy pad disposed between inpu...
- Patent number 11,355,476
- Issue date Jun 7, 2022
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
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- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 11,342,293
- Issue date May 24, 2022
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- Toshiyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit connection method and electronic circuit
- Patent number 11,270,968
- Issue date Mar 8, 2022
- National Institute of Advanced Industrial Science and Technology
- Masaru Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
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- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,121,077
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- Ji Yeon Ryu
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Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 11,024,782
- Issue date Jun 1, 2021
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
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Information Patent Grant
Micro-transfer-printable flip-chip structures and methods
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- Issue date Mar 30, 2021
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- Christopher Bower
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Information Patent Grant
Semiconductor package
- Patent number 10,943,881
- Issue date Mar 9, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK
- Publication number 20250125284
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...
- Publication number 20250096117
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Anshih TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20250087614
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
- Publication number 20240355766
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE
- Publication number 20240297130
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266308
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Kiseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
- Publication number 20240113042
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20240071942
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Young kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...
- Publication number 20230420411
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411323
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Etsuko WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20230402418
- Publication date Dec 14, 2023
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230317648
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230207490
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Yung Sheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230163089
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIF...
- Publication number 20230057560
- Publication date Feb 23, 2023
- SK HYNIX INC.
- Jun Yong SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220328439
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS
- Publication number 20220310540
- Publication date Sep 29, 2022
- ROCKLEY PHOTONICS LIMITED
- Michael LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PACKAGE CONFIGURATION
- Publication number 20220199579
- Publication date Jun 23, 2022
- CCS Technology Corporation
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20220130793
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY
- Publication number 20220059492
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS

the bonding areas being at different heights

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device, manufacturing method thereof and display mod...

Semiconductor packages and methods of forming same

Semiconductor device including re-distribution pads disposed at dif...

Bump coplanarity for semiconductor device assembly and methods of m...

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor package and manufacturing method thereof

Silicon photonic interposer with two metal redistribution layers

Semiconductor package including semiconductor chips

Semiconductor package

Bump coplanarity for semiconductor device assembly and methods of m...

Light-emitting device, manufacturing method thereof and display mod...

Display device having side surface connection pads

Semiconductor package including semiconductor chips

Semiconductor package for improving reliability

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

3D package configuration

Multi-chip package structure having dummy pad disposed between inpu...

Multi-chip package structure having dummy pad disposed between inpu...

Semiconductor packages and methods of forming same

Semiconductor apparatus and equipment

Electronic circuit connection method and electronic circuit

Methods for bump planarity control

Semiconductor device and method of manufacturing a semiconductor de...

Light-emitting device, manufacturing method thereof and display mod...

Illumination device

Semiconductor package and manufacturing method thereof

Micro-transfer-printable flip-chip structures and methods

Semiconductor package

Bump-forming film, semiconductor device and manufacturing method th...

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Patents Applicationslast 30 patents

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

Semiconductor Packages and Methods of Forming Same

ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

GALVANIC ISOLATION DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

Semiconductor Devices and Methods of Manufacture

SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIF...

DISPLAY DEVICE

SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS

Semiconductor Packages and Methods of Forming Same

3D PACKAGE CONFIGURATION

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY