the bonding areas being at different heights

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H01L2224/09102

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09102the bonding areas being at different heights

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 11,587,901
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesives and adhesive films
- Patent number 6,452,111
- Issue date Sep 17, 2002
- Sony Chemicals Corp.
- Hiroyuki Kumakura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
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- Avago Technologies International Sales Pte. Limited
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Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170456
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- Samsung Electronics Co., Ltd.
- Seo Eun KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20220310545
- Publication date Sep 29, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesives and adhesive films
- Publication number 20020070048
- Publication date Jun 13, 2002
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- H01 - BASIC ELECTRIC ELEMENTS