the bump being used as a mask for patterning other parts

Industry

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H01L2224/11912

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11912the bump being used as a mask for patterning other parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor die
- Patent number 12,021,057
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,894,329
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 11,862,593
- Issue date Jan 2, 2024
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,404,390
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE48420
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Method of manufacturing a semiconductor structure
- Patent number 10,861,711
- Issue date Dec 8, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,833,034
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching solution for copper or copper alloy
- Patent number 10,570,522
- Issue date Feb 25, 2020
- Entegris, Inc.
- Yutaka Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE46618
- Issue date Nov 28, 2017
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,754,907
- Issue date Sep 5, 2017
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE46466
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 9,607,862
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,548,271
- Issue date Jan 17, 2017
- Mediatek Inc.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bumps and process for making same
- Patent number 9,449,931
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a patterned conducting plate and method for for...
- Patent number 9,437,457
- Issue date Sep 6, 2016
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240321814
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20240136315
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20240088080
- Publication date Mar 14, 2024
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20230217593
- Publication date Jul 6, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...
- Publication number 20230178501
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL TH...
- Publication number 20230087810
- Publication date Mar 23, 2023
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20230063539
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...
- Publication number 20220395935
- Publication date Dec 15, 2022
- SHINRYO CORPORATION
- Hirotoshi NISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20220359444
- Publication date Nov 10, 2022
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20220328442
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20220208669
- Publication date Jun 30, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20210407944
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210257332
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210057366
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-CHENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200185345
- Publication date Jun 11, 2020
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKA...
- Publication number 20200075524
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20200035631
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-CHENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Post-Passivation Interconnect Structure
- Publication number 20170200687
- Publication date Jul 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150087115
- Publication date Mar 26, 2015
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS

the bump being used as a mask for patterning other parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming semiconductor package and semiconductor package

Semiconductor structure and semiconductor die

Semiconductor structure having polygonal bonding pad

Semiconductor device assembly with sacrificial pillars and methods...

Electroplated indium bump stacks for cryogenic electronics

Semiconductor package

Method of manufacturing semiconductor structure having polygonal bo...

Semiconductor device and manufacturing method thereof

Alternative integration for redistribution layer process

Semiconductor device assembly with sacrificial pillars and methods...

Method of making a pillar structure having a non-metal sidewall pro...

Mechanisms for forming post-passivation interconnect structure

Method for fabricating low resistance, low inductance interconnecti...

Method of manufacturing a semiconductor structure

Semiconductor package

Tall and fine pitch interconnects

Etching solution for copper or copper alloy

Mechanisms for forming post-passivation interconnect structure

Tooling for coupling multiple electronic chips

Tall and fine pitch interconnects

Extrusion-resistant solder interconnect structures and methods of f...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Method for fabricating low resistance, low inductance interconnecti...

Tooling for coupling multiple electronic chips

Method for fabricating low resistance, low inductance interconnecti...

Wafer to wafer bonding process and structures

Extrusion-resistant solder interconnect structures and methods of f...

Semiconductor package

Pillar bumps and process for making same

Chip package having a patterned conducting plate and method for for...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

PACKAGE SUBSTRATE

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...

ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL TH...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

Method for Forming Semiconductor Package and Semiconductor Package

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKA...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

TALL AND FINE PITCH INTERCONNECTS

Tall and Fine Pitch Interconnects

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

Mechanisms for Forming Post-Passivation Interconnect Structure

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Pillar Bumps and Process for Making Same

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...