the bump connector being at least partially embedded in the surface

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H01L2224/16112

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16112the bump connector being at least partially embedded in the surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,177,249
- Issue date Nov 16, 2021
- SK hynix Inc.
- Kun Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,101,231
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 11,094,612
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,063,015
- Issue date Jul 13, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a flip chip semiconductor package and a c...
- Patent number 10,872,845
- Issue date Dec 22, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,720,360
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 10,700,001
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,622,320
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 10,593,652
- Issue date Mar 17, 2020
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,510,605
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 10,403,606
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,304,803
- Issue date May 28, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive layer and conductive pill...
- Patent number 10,249,589
- Issue date Apr 2, 2019
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for connecting packages onto printed circuit b...
- Patent number 10,068,873
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for an improved fine pitch joint
- Patent number 10,062,659
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a chip assemblage
- Patent number 10,014,275
- Issue date Jul 3, 2018
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacked semiconductor packages and methods of fabrica...
- Patent number 9,978,721
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral vias for connections to buried microconductors
- Patent number 9,972,565
- Issue date May 15, 2018
- National Technology & Engineering Solutions of Sandia, LLC
- David P. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,922,957
- Issue date Mar 20, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,793,234
- Issue date Oct 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230245967
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230018511
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257324
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20200350209
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200243499
- Publication date Jul 30, 2020
- SK HYNIX INC.
- Kun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200219834
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- Jong-youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20180331071
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS...
- Publication number 20180269143
- Publication date Sep 20, 2018
- National Technology & Engineering Solutions of Sandia, LLC
- David P. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20170301645
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CHIP ASSEMBLAGE
- Publication number 20170271298
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20170250153
- Publication date Aug 31, 2017
- Fujitsu Limited
- Ryo Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170069600
- Publication date Mar 9, 2017
- Kabushiki Kaisha Toshiba
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20160351473
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Kengo UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Fine Pitch Joint
- Publication number 20160148889
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION FILM FOR IC PACKAGE
- Publication number 20160141262
- Publication date May 19, 2016
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20160111392
- Publication date Apr 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...
- Publication number 20150228627
- Publication date Aug 13, 2015
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150171064
- Publication date Jun 18, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-...
- Publication number 20150108643
- Publication date Apr 23, 2015
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Bump Bonding
- Publication number 20140264796
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20140252593
- Publication date Sep 11, 2014
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Fine Pitch Joint
- Publication number 20140187103
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...
- Publication number 20140103522
- Publication date Apr 17, 2014
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- Publication number 20140054763
- Publication date Feb 27, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING

the bump connector being at least partially embedded in the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Semiconductor package and manufacturing method thereof

Bonding interposer and integrated circuit chip, and ultrasound prob...

Forming bonding structures by using template layer as templates

Semiconductor die singulation and structures formed thereby

Semiconductor memory device and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device package and method of manufacturing the same

Semiconductor device

Process for manufacturing a flip chip semiconductor package and a c...

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor die singulation and structures formed thereby

Forming bonding structures by using template layer as templates

Semiconductor package and method of manufacturing the same

Nanoscale interconnect array for stacked dies

Stacked semiconductor packages

Semiconductor die singulation and structures formed thereby

Method of fabricating a semiconductor package

Nanoscale interconnect array for stacked dies

Semiconductor device including conductive layer and conductive pill...

Method and apparatus for connecting packages onto printed circuit b...

System and method for an improved fine pitch joint

Method for producing a chip assemblage

Apparatus for stacked semiconductor packages and methods of fabrica...

Lateral vias for connections to buried microconductors

Semiconductor device and method for manufacturing the same

Chip package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

Semiconductor Die Singulation and Structures Formed Thereby

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS...

Nanoscale Interconnect Array for Stacked Dies

Method and Apparatus for Connecting Packages onto Printed Circuit B...

METHOD FOR PRODUCING A CHIP ASSEMBLAGE

ELECTRONIC PART, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

System and Method for an Improved Fine Pitch Joint

REDISTRIBUTION FILM FOR IC PACKAGE

Method and Apparatus for Connecting Packages onto Printed Circuit B...

STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-...

Insulated Bump Bonding

Method and Apparatus for Connecting Packages onto Printed Circuit B...

System and Method for an Improved Fine Pitch Joint

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...

THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD