the bump connector being embedded into the layer connector

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H01L2224/73104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73104the bump connector being embedded into the layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,165,951
- Issue date Dec 10, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
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- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
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- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
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- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
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Information Patent Grant
Semiconductor manufacturing apparatus
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Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
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Information Patent Grant
Package comprising spacers between integrated devices
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
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- Issue date Mar 5, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a resin that seals a rewiring
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- Manato Kurata
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Information Patent Grant
Microelectronic device with embedded die substrate on interposer
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
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Information Patent Grant
RF devices with enhanced performance and methods of forming the same
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Information Patent Grant
Semiconductor package with improved reliability
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- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package with reduced underfill area
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- Issue date Dec 5, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
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Information Patent Grant
Semiconductor package
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- Ae-nee Jang
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Information Patent Grant
Package substrates with magnetic build-up layers
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- Zhiguo Qian
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Information Patent Grant
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Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Microelectronic device with embedded die substrate on interposer
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- Issue date Aug 30, 2022
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing power semiconductor device and power semico...
- Patent number 11,270,982
- Issue date Mar 8, 2022
- Mitsubishi Electric Corporation
- Norikazu Sakai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
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- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
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- Publication number 20240332241
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PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING...
- Publication number 20240282721
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- Tsung-Yuan Yu
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Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
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NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
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- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Haohua MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
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- Samsung Electronics Co., Ltd.
- Sang-Sick Park
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Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240030210
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- Samsung Electronics Co., Ltd.
- Juyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
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- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS
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- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
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- Toshiaki IWAFUCHI
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SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...
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- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
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- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
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- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230117132
- Publication date Apr 20, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS
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- Intel Corporation
- Gerald PASDAST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
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- Publication date Mar 30, 2023
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- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
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- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
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- H01 - BASIC ELECTRIC ELEMENTS
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- Taejin CHOI
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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- Publication date Jan 19, 2023
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- YeongBeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING STACKED SEMICONDUCTOR DICE
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- Publication date Dec 22, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220310550
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
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- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being embedded into the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

RF devices with enhanced performance and methods of forming the same

Metal bonding structure and manufacturing method thereof

Semiconductor package and method of manufacturing the same

RF devices with enhanced performance and methods of forming the same

Microelectronic device with embedded die substrate on interposer

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor manufacturing apparatus

Semiconductor device with a multi-layered encapsulant and associate...

Package comprising spacers between integrated devices

Die attached leveling control by metal stopper bumps

Multilayer substrate

Semiconductor device having a resin that seals a rewiring

Microelectronic device with embedded die substrate on interposer

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Semiconductor package with improved reliability

Flip-chip package with reduced underfill area

Semiconductor device comprising a can housing a semiconductor die w...

Method for manufacturing display panel, display panel, and display...

Semiconductor package

Package substrates with magnetic build-up layers

Semiconductor package structure

Adhesive for semiconductor device, and high productivity method for...

RF devices with enhanced performance and methods of forming the same

Semiconductor device

Manufacturing method for semiconductor package including filling me...

Microelectronic device with embedded die substrate on interposer

Sensor systems and methods for providing sensor systems

Method of manufacturing power semiconductor device and power semico...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

DISPLAY APPARATUS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS

SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS

METHOD FOR USING A BUFFER SHEET

BONDING APPARATUS AND BONDING METHOD USING THE SAME

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGES HAVING STACKED SEMICONDUCTOR DICE

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING APPARATUS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS