the bump connector being embedded into the layer connector

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H01L2224/73104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73104the bump connector being embedded into the layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer structure with support features and methods
- Patent number 12,354,940
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 12,334,481
- Issue date Jun 17, 2025
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,165,951
- Issue date Dec 10, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,046,535
- Issue date Jul 23, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a resin that seals a rewiring
- Patent number 11,894,325
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Manato Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,869,825
- Issue date Jan 9, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,862,532
- Issue date Jan 2, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved reliability
- Patent number 11,854,924
- Issue date Dec 26, 2023
- Mediatek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package with reduced underfill area
- Patent number 11,837,476
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,670,596
- Issue date Jun 6, 2023
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
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- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...
- Publication number 20250132283
- Publication date Apr 24, 2025
- Brewer Science, Inc.
- Xin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
- Publication number 20250125302
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING...
- Publication number 20240282721
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20240222145
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240213197
- Publication date Jun 27, 2024
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Haohua MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240030210
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Juyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
- Publication date Dec 14, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS
- Publication number 20230395481
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
- Publication number 20230343803
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Toshiaki IWAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...
- Publication number 20230307374
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230117132
- Publication date Apr 20, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS
- Publication number 20230100228
- Publication date Mar 30, 2023
- Intel Corporation
- Gerald PASDAST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20230041651
- Publication date Feb 9, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...
- Publication number 20230027838
- Publication date Jan 26, 2023
- Doosan Corporation
- Taejin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230018676
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- YeongBeom KO
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being embedded into the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution layer structure with support features and methods

Micro light-emitting diode

Die attached leveling control by metal stopper bumps

Semiconductor package and method of fabricating the same

Packaging structure and method for preparing same

Method for manufacturing display panel, display panel, and display...

RF devices with enhanced performance and methods of forming the same

Metal bonding structure and manufacturing method thereof

Semiconductor package and method of manufacturing the same

RF devices with enhanced performance and methods of forming the same

Microelectronic device with embedded die substrate on interposer

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor manufacturing apparatus

Semiconductor device with a multi-layered encapsulant and associate...

Package comprising spacers between integrated devices

Die attached leveling control by metal stopper bumps

Multilayer substrate

Semiconductor device having a resin that seals a rewiring

Microelectronic device with embedded die substrate on interposer

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Semiconductor package with improved reliability

Flip-chip package with reduced underfill area

Semiconductor device comprising a can housing a semiconductor die w...

Method for manufacturing display panel, display panel, and display...

Semiconductor package

Package substrates with magnetic build-up layers

Semiconductor package structure

Adhesive for semiconductor device, and high productivity method for...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...

SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

DISPLAY APPARATUS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS

SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

PHYSICAL AND ELECTRICAL PROTOCOL TRANSLATION CHIPLETS

METHOD FOR USING A BUFFER SHEET

BONDING APPARATUS AND BONDING METHOD USING THE SAME

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME