TREA

the bump connector being offset with respect to the bonding area

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Industry

  • CPC
  • H01L2224/13027
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13027the bump connector being offset with respect to the bonding area
Industries