the bump connector being offset with respect to the bonding area

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H01L2224/13027

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13027the bump connector being offset with respect to the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal compression flip chip bump for high performance and fine pitch
- Patent number 12,113,038
- Issue date Oct 8, 2024
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 11,495,568
- Issue date Nov 8, 2022
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,469,200
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,957,719
- Issue date Mar 23, 2021
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 10,943,882
- Issue date Mar 9, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,564
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with rigid under bump metallurgy (UBM) stack
- Patent number 10,756,040
- Issue date Aug 25, 2020
- Mediatek Inc.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 10,593,639
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with a conductive post
- Patent number 10,446,411
- Issue date Oct 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal pad modification
- Patent number 10,373,925
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,304,867
- Issue date May 28, 2019
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,297,561
- Issue date May 21, 2019
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging semiconductor devices
- Patent number 10,269,750
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with bump stop structure
- Patent number 10,269,749
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a bump contact on a TSV comprising a cavi...
- Patent number 10,217,715
- Issue date Feb 26, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including bump
- Patent number 10,157,873
- Issue date Dec 18, 2018
- SK hynix Inc.
- Jun-Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating packaging layer of fan-out chip package
- Patent number 10,121,736
- Issue date Nov 6, 2018
- Powertech Technology Inc.
- Kuo-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 10,090,271
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347510
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...
- Publication number 20240030173
- Publication date Jan 25, 2024
- NXP B.V.
- Che Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230088170
- Publication date Mar 23, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION FLIP CHIP BUMP
- Publication number 20210210449
- Publication date Jul 8, 2021
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210151403
- Publication date May 20, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082849
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210066227
- Publication date Mar 4, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200235131
- Publication date Jul 23, 2020
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD MODIFICATION
- Publication number 20190295978
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20190244978
- Publication date Aug 8, 2019
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD MODIFICATION
- Publication number 20190244923
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20190198470
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD MODIFICATION
- Publication number 20190006304
- Publication date Jan 3, 2019
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMP
- Publication number 20180366430
- Publication date Dec 20, 2018
- SK HYNIX INC.
- Jun-Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180331059
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK
- Publication number 20180233474
- Publication date Aug 16, 2018
- MEDIATEK INC.
- Ta-Jen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180175067
- Publication date Jun 21, 2018
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING PACKAGING LAYER OF FAN-OUT CHIP PACKAGE
- Publication number 20180145015
- Publication date May 24, 2018
- Powertech Technology Inc.
- Kuo-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20180096970
- Publication date Apr 5, 2018
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20170256512
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING CONTINUOUS THROUGH HOLE VIA C...
- Publication number 20170256471
- Publication date Sep 7, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Connector Structures of Integrated Circuits
- Publication number 20170229413
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP PACKAGE AND ITS FABRICATING METHOD
- Publication number 20170186678
- Publication date Jun 29, 2017
- Powertech Technology Inc.
- KUO-TING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170162540
- Publication date Jun 8, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20170025351
- Publication date Jan 26, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EMI Shielding Layer with...
- Publication number 20170018507
- Publication date Jan 19, 2017
- STATS ChipPAC Pte Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being offset with respect to the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal compression flip chip bump for high performance and fine pitch

Semiconductor structure having polygonal bonding pad

Metal pad modification

Semiconductor device and method of making wafer level chip scale pa...

IC package design and methodology to compensate for die-substrate C...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device

Semiconductor device and a method of manufacturing the same

Device-bonded body, image pickup module, endoscope and method for m...

Semiconductor device and a method of manufacturing the same

Interconnect structures for preventing solder bridging, and associa...

IC package design and methodology to compensate for die-substrate C...

Semiconductor device and manufacturing method thereof

Semiconductor package with rigid under bump metallurgy (UBM) stack

Semiconductor device and a method of manufacturing the same

Semiconductor chip, method for manufacturing semiconductor chip, in...

Semiconductor device and method of forming EMI shielding layer with...

Interconnect structures for preventing solder bridging, and associa...

Metal pad modification

Semiconductor device package with a conductive post

Metal pad modification

Semiconductor device and a method of manufacturing the same

Interconnect structures for preventing solder bridging, and associa...

Methods and apparatus of packaging semiconductor devices

Method of forming a semiconductor device with bump stop structure

Semiconductor device with a bump contact on a TSV comprising a cavi...

Semiconductor device and a method of manufacturing the same

Semiconductor package including bump

Method of fabricating packaging layer of fan-out chip package

Metal pad modification

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

THERMAL COMPRESSION FLIP CHIP BUMP

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

METAL PAD MODIFICATION

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METAL PAD MODIFICATION

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

METAL PAD MODIFICATION

SEMICONDUCTOR PACKAGE INCLUDING BUMP

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD OF FABRICATING PACKAGING LAYER OF FAN-OUT CHIP PACKAGE

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Methods and Apparatus of Packaging Semiconductor Devices

WAFER LEVEL CHIP SCALE PACKAGE HAVING CONTINUOUS THROUGH HOLE VIA C...

Method of Manufacturing Connector Structures of Integrated Circuits

FAN-OUT CHIP PACKAGE AND ITS FABRICATING METHOD

WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

Semiconductor Device and Method of Forming EMI Shielding Layer with...