the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industry

CPC
H01L2224/16151

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate comprising a high-density interconnect portion embedded i...
- Patent number 11,552,015
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with leadframe having pre-singulated leads or...
- Patent number 10,840,211
- Issue date Nov 17, 2020
- Texas Instruments Incorporated
- Bradley Andrew Glasscock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC carrier of semiconductor package and manufacturing method thereof
- Patent number 9,806,012
- Issue date Oct 31, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,711,693
- Issue date Jul 18, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having substrate with embedded metal trace overlapped by la...
- Patent number 9,559,076
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for controlling positions of stacked dies
- Patent number 9,209,165
- Issue date Dec 8, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ramp-stack chip package with static bends
- Patent number 8,283,766
- Issue date Oct 9, 2012
- Oracle America, Inc.
- John A. Harada
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178491
- Publication date Jun 8, 2023
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20170317247
- Publication date Nov 2, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Having Substrate With Embedded Metal Trace Overlapped by La...
- Publication number 20160211239
- Publication date Jul 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH STATIC BENDS
- Publication number 20120056327
- Publication date Mar 8, 2012
- Oracle International Corporation
- John A. Harada
- G02 - OPTICS

the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate comprising a high-density interconnect portion embedded i...

Semiconductor package with leadframe having pre-singulated leads or...

IC carrier of semiconductor package and manufacturing method thereof

Method of fabricating semiconductor device using gang bonding and s...

Package having substrate with embedded metal trace overlapped by la...

Technique for controlling positions of stacked dies

Ramp-stack chip package with static bends

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

Package Having Substrate With Embedded Metal Trace Overlapped by La...

RAMP-STACK CHIP PACKAGE WITH STATIC BENDS