the bump connector connecting to a bond pad of the item

Industry

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H01L2224/16157

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16157the bump connector connecting to a bond pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device package having dummy...
- Patent number 12,125,822
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with thermal interface materials with d...
- Patent number 12,062,592
- Issue date Aug 13, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
- Patent number 11,908,820
- Issue date Feb 20, 2024
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) with multi-row columnar die interconnects...
- Patent number 11,791,272
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Rong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,913
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,646,287
- Issue date May 9, 2023
- Kioxia Corporation
- Satoru Takaku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar transistors with wrap-around gates and wrap-around source an...
- Patent number 11,588,037
- Issue date Feb 21, 2023
- Intel Corporation
- Nidhi Nidhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 11,557,491
- Issue date Jan 17, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,462,455
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding of electronic components
- Patent number 11,456,277
- Issue date Sep 27, 2022
- Dyconex AG
- Eckardt Bihler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
- Patent number 11,417,579
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
- Patent number 11,322,469
- Issue date May 3, 2022
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor systems and methods for providing sensor systems
- Patent number 11,289,444
- Issue date Mar 29, 2022
- General Electric Company
- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability testing method and apparatus
- Patent number 11,226,363
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Ruei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure having high density chip interconnect...
- Patent number 11,133,259
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and method for manufacturing the same
- Patent number 11,031,274
- Issue date Jun 8, 2021
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Yu-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and electronic system with impedance matched in...
- Patent number 10,991,674
- Issue date Apr 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-grind die backside power delivery
- Patent number 10,910,301
- Issue date Feb 2, 2021
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
- Patent number 10,748,827
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,700,034
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package cover having underside rib
- Patent number 10,665,524
- Issue date May 26, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,637,413
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure
- Publication number 20250006684
- Publication date Jan 2, 2025
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404921
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
- Publication number 20240396198
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES
- Publication number 20240371829
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Die Substrate with Edge-Mounted Capacitors
- Publication number 20240332223
- Publication date Oct 3, 2024
- NVIDIA Corporation
- Tracy Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240319454
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL CHIP WITH VARIABLE PACKAGING
- Publication number 20240312892
- Publication date Sep 19, 2024
- Meta Platforms Technologies, LLC
- Rajendra D. PENDSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP
- Publication number 20240304504
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Boin NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088108
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240063078
- Publication date Feb 22, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230335512
- Publication date Oct 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...
- Publication number 20230307374
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170329
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR
- Publication number 20230108902
- Publication date Apr 6, 2023
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230026633
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230016061
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES
- Publication number 20220384390
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220337029
- Publication date Oct 20, 2022
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS...
- Publication number 20220285280
- Publication date Sep 8, 2022
- QUALCOMM Incorporated
- Rong ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Chip Packages and a Chip Package
- Publication number 20220181296
- Publication date Jun 9, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES AND METHOD OF FORMIN...
- Publication number 20220157777
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028815
- Publication date Jan 27, 2022
- KIOXIA Corporation
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210358866
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Eun-Kyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES
- Publication number 20210335718
- Publication date Oct 28, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS
- Publication number 20210183808
- Publication date Jun 17, 2021
- GENERAL ELECTRIC COMPANY
- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...
- Publication number 20210183773
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective underfill assembly and method therefor

Method of manufacturing a semiconductor device package having dummy...

Semiconductor package and manufacturing method thereof

Method for forming chip packages and a chip package having a chipse...

Integrated circuit packages with thermal interface materials with d...

Dual solder methodologies for ultrahigh density first level interco...

Methods of embedding magnetic structures in substrates

Integrated circuits (ICs) with multi-row columnar die interconnects...

Package substrates with magnetic build-up layers

Semiconductor package

Semiconductor device

Planar transistors with wrap-around gates and wrap-around source an...

Selective underfill assembly and method therefor

Semiconductor package device and method of manufacturing the same

Thermocompression bonding of electronic components

Packaged semiconductor devices for high voltage with die edge prote...

Semiconductor structure having a dielectric layer edge covering cir...

Dual solder methodologies for ultrahigh density first level interco...

Sensor systems and methods for providing sensor systems

Methods of embedding magnetic structures in substrates

Reliability testing method and apparatus

Multi-chip package structure having high density chip interconnect...

Package substrates with magnetic build-up layers

Semiconductor device packages and method for manufacturing the same

Electronic assembly and electronic system with impedance matched in...

Post-grind die backside power delivery

Packaged semiconductor devices for high voltage with die edge prote...

Protrusion bump pads for bond-on-trace processing

Electronic package cover having underside rib

Semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Bonding structure

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES

Chip Die Substrate with Edge-Mounted Capacitors

SEMICONDUCTOR PACKAGE

UNIVERSAL CHIP WITH VARIABLE PACKAGING

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS...

Method for Forming Chip Packages and a Chip Package

SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES AND METHOD OF FORMIN...

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES

SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS

MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...