the bump connector connecting to a bonding area disposed in a recess of the surface of the item

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CPC
H01L2224/16167

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16167the bump connector connecting to a bonding area disposed in a recess of the surface of the item

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED SELF-ALIGNED ASSEMBLY
- Publication number 20220122924
- Publication date Apr 21, 2022
- ROCKLEY PHOTONICS LIMITED
- Chia-Te CHOU
- H01 - BASIC ELECTRIC ELEMENTS