TREA

the bump connector connecting to a bonding area disposed in a recess of the surface of the item

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Industry

  • CPC
  • H01L2224/16167
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16167the bump connector connecting to a bonding area disposed in a recess of the surface of the item
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    INTEGRATED SELF-ALIGNED ASSEMBLY
    • Publication number 20220122924
    • Publication date Apr 21, 2022
    • ROCKLEY PHOTONICS LIMITED
    • Chia-Te CHOU
    • H01 - BASIC ELECTRIC ELEMENTS