the bump connector connecting to a bonding area disposed in a recess of the surface of the item

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CPC
H01L2224/16267

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16267the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Vertical inductor for WLCSP
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Information Patent Grant
Substrate assembly with encapsulated magnetic feature
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,250,981
- Issue date Feb 15, 2022
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems in packages including wide-band phased-array antennas and m...
- Patent number 10,978,434
- Issue date Apr 13, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 10,784,033
- Issue date Sep 22, 2020
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems in packages including wide-band phased-array antennas and m...
- Patent number 10,580,761
- Issue date Mar 3, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-embedded substrate and electronic component de...
- Patent number 10,321,574
- Issue date Jun 11, 2019
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,793,234
- Issue date Oct 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling and known good die test method
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- Issue date Mar 21, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded sheet capacitor
- Patent number 9,502,491
- Issue date Nov 22, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stubby pads for channel cross-talk reduction
- Patent number 9,105,635
- Issue date Aug 11, 2015
- Intel Corporation
- Nevin Altunyurt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 8,846,447
- Issue date Sep 30, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of packaging substrate having through-holed inte...
- Patent number 8,709,865
- Issue date Apr 29, 2014
- Unimicron Technology Corporation
- Yu-Shan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having through-holed interposer embedded therei...
- Patent number 8,269,337
- Issue date Sep 18, 2012
- Unimicron Technology Corporation
- Yu-Shan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...
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- Publication date Apr 18, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230089615
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kenichi AGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) US...
- Publication number 20210384292
- Publication date Dec 9, 2021
- QUALCOMM Incorporated
- Karim ARABI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...
- Publication number 20200168592
- Publication date May 28, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...
- Publication number 20190181126
- Publication date Jun 13, 2019
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT DE...
- Publication number 20180098430
- Publication date Apr 5, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315061
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION
- Publication number 20140264907
- Publication date Sep 18, 2014
- Nevin ALTUNYURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- Publication number 20140054763
- Publication date Feb 27, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING THROUGH-HOLED INTE...
- Publication number 20130040427
- Publication date Feb 14, 2013
- Unimicron Technology Corporation
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING THROUGH-HOLED INTERPOSER EMBEDDED THEREI...
- Publication number 20120146209
- Publication date Jun 14, 2012
- Unimicron Technology Corporation
- Yu-Shan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vertical inductor for WLCSP

Substrate assembly with encapsulated magnetic feature

Substrate assembly with encapsulated magnetic feature

Vertical inductor for WLCSP

Systems in packages including wide-band phased-array antennas and m...

Vertical inductor for WLCSP

Systems in packages including wide-band phased-array antennas and m...

Electronic component-embedded substrate and electronic component de...

Chip package and manufacturing method thereof

Thin wafer handling and known good die test method

Embedded sheet capacitor

Stubby pads for channel cross-talk reduction

Thin wafer handling and known good die test method

Fabrication method of packaging substrate having through-holed inte...

Packaging substrate having through-holed interposer embedded therei...

Patents Applicationslast 30 patents

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED IN...

SEMICONDUCTOR DEVICE

INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) US...

SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...

SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...

ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT DE...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION

THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD

FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING THROUGH-HOLED INTE...

PACKAGING SUBSTRATE HAVING THROUGH-HOLED INTERPOSER EMBEDDED THEREI...