the bump connector connecting to a bonding area disposed in a recess of the surface of the item

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H01L2224/16257

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16257the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 11,677,059
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 10,971,668
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 10,892,391
- Issue date Jan 12, 2021
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a flip chip semiconductor package and a c...
- Patent number 10,872,845
- Issue date Dec 22, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package and light source apparatus
- Patent number 10,672,959
- Issue date Jun 2, 2020
- LG Innotek Co., Ltd
- Tae Sung Lee
- F21 - LIGHTING
Information Patent Grant
Light emitting device package including a lead frame
- Patent number 10,510,936
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method thereof
- Patent number 10,163,820
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for light emitting diode
- Patent number 9,852,967
- Issue date Dec 26, 2017
- ECOCERA OPTRONICS CO., LTD.
- Yu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with thermal spacers and assoc...
- Patent number 9,818,625
- Issue date Nov 14, 2017
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and composite module
- Patent number 9,761,567
- Issue date Sep 12, 2017
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 9,601,398
- Issue date Mar 21, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 8,846,447
- Issue date Sep 30, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for flip-chip-on-lead semiconductor package
- Patent number 8,785,250
- Issue date Jul 22, 2014
- Allegro Microsystems, LLC
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for manufacturing the same
- Patent number 8,426,255
- Issue date Apr 23, 2013
- ChipMOS Technologies, Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer sheet, heat transfer structural body and manufacturin...
- Patent number 7,610,678
- Issue date Nov 3, 2009
- Fujitsu Limited
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and lead frame, and method...
- Patent number 7,495,319
- Issue date Feb 24, 2009
- Panasonic Corporation
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
- Patent number 7,361,531
- Issue date Apr 22, 2008
- Allegro Microsystems, Inc.
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING BONDING ELEMENT
- Publication number 20240203915
- Publication date Jun 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING BONDING ELEMENT
- Publication number 20240203916
- Publication date Jun 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
- Publication number 20230187390
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian MEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING CAPACITOR COUPLING POWER PATH TO GROUND PATH AND...
- Publication number 20230124251
- Publication date Apr 20, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yuming Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220157758
- Publication date May 19, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING RESIDUAL TEST PATTERN
- Publication number 20200303268
- Publication date Sep 24, 2020
- SAMSUNG ELECTRONICS CO., LTD.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE PACKAGE
- Publication number 20200251643
- Publication date Aug 6, 2020
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity based feature on chip carrier
- Publication number 20200020649
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity based feature on chip carrier
- Publication number 20170317036
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOC...
- Publication number 20160181125
- Publication date Jun 23, 2016
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- Publication number 20140054763
- Publication date Feb 27, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130065361
- Publication date Mar 14, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD...
- Publication number 20090130801
- Publication date May 21, 2009
- PANASONIC CORPORATION
- Toshiyuki FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20080230879
- Publication date Sep 25, 2008
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
- Publication number 20070099348
- Publication date May 3, 2007
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat transfer sheet, heat transfer structural body and manufacturin...
- Publication number 20060037741
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Hideshi Tokuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and lead frame, and method...
- Publication number 20050194676
- Publication date Sep 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Direct bonded heterogeneous integration silicon bridge

Light-emitting device package including a lead frame

Light-emitting device package including a lead frame

Light-emitting device package including a lead frame

Process for manufacturing a flip chip semiconductor package and a c...

Light emitting device package and light source apparatus

Light emitting device package including a lead frame

Chip carrier and method thereof

Lead frame structure for light emitting diode

Stacked semiconductor die assemblies with thermal spacers and assoc...

Power semiconductor module and composite module

Thin wafer handling and known good die test method

Thin wafer handling and known good die test method

Methods and apparatus for flip-chip-on-lead semiconductor package

Chip package structure and method for manufacturing the same

Heat transfer sheet, heat transfer structural body and manufacturin...

Resin-encapsulated semiconductor device and lead frame, and method...

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING BONDING ELEMENT

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING BONDING ELEMENT

SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER

DEVICES INCLUDING CAPACITOR COUPLING POWER PATH TO GROUND PATH AND...

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING RESIDUAL TEST PATTERN

LIGHT-EMITTING DEVICE PACKAGE

Cavity based feature on chip carrier

Cavity based feature on chip carrier

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOC...

THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD...

METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Heat transfer sheet, heat transfer structural body and manufacturin...

Resin-encapsulated semiconductor device and lead frame, and method...