the bump connector connecting to a via metallisation of the item

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H01L2224/16165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16165the bump connector connecting to a via metallisation of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,051,649
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer
- Patent number 11,791,325
- Issue date Oct 17, 2023
- Samsung Electronics Co, Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 11,769,731
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
- Patent number 10,366,965
- Issue date Jul 30, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, display panel assembly, semiconductor structure
- Patent number 9,960,151
- Issue date May 1, 2018
- Novatek Microelectronics Corp.
- Chieh-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated DC-DC power converters
- Patent number 9,819,269
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic package with narrow-factor via including finish layer
- Patent number 9,603,247
- Issue date Mar 21, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package and manufacturing method thereof
- Patent number 9,349,611
- Issue date May 24, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming flipchip interconnection...
- Patent number 9,345,148
- Issue date May 17, 2016
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate comprising inorganic material that lowers the coefficient...
- Patent number 9,155,191
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency switch
- Patent number 8,698,574
- Issue date Apr 15, 2014
- Kabushiki Kaisha Toshiba
- Masayuki Sugiura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package including a stacking element
- Patent number 8,405,213
- Issue date Mar 26, 2013
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an internal cooling system
- Patent number 8,358,016
- Issue date Jan 22, 2013
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing the switching noise on substrate with high grounding resis...
- Patent number 8,269,350
- Issue date Sep 18, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an internal cooling system
- Patent number 8,159,065
- Issue date Apr 17, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
- Publication number 20240355746
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240047385
- Publication date Feb 8, 2024
- Huawei Technologies Co., Ltd
- Kehan Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for Computing System Package
- Publication number 20240038669
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND EQUIPMENT
- Publication number 20240006389
- Publication date Jan 4, 2024
- Canon Kabushiki Kaisha
- HIROAKI KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230011353
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384381
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...
- Publication number 20220328371
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for Computing System Package
- Publication number 20220223530
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20220028848
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- KIWON BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190189577
- Publication date Jun 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
- Publication number 20190131271
- Publication date May 2, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID
- Publication number 20180166356
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- Shahid A. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, DISPLAY PANEL ASSEMBLY, SEMICONDUCTOR STRUCTURE
- Publication number 20180040596
- Publication date Feb 8, 2018
- NOVATEK MICROELECTRONICS CORP.
- Chieh-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER
- Publication number 20160044786
- Publication date Feb 11, 2016
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INORGANIC MATERIAL THAT LOWERS THE COEFFICIENT...
- Publication number 20140356635
- Publication date Dec 4, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130171774
- Publication date Jul 4, 2013
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM
- Publication number 20120175783
- Publication date Jul 12, 2012
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SWITCH
- Publication number 20120038411
- Publication date Feb 16, 2012
- Kabushiki Kaisha Toshiba
- Masayuki Sugiura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor Device and Method of Forming Flipchip Interconnection...
- Publication number 20110304058
- Publication date Dec 15, 2011
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110227220
- Publication date Sep 22, 2011
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM
- Publication number 20100224990
- Publication date Sep 9, 2010
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a via metallisation of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-hole electrode substrate

Architecture for computing system package

Package structure with a barrier layer

Electronic device package and method of manufacturing the same

Semiconductor package including interposer

Architecture for computing system package

Package substrates with magnetic build-up layers

Method for forming package structure with a barrier layer

Semiconductor structure having a dielectric layer edge covering cir...

Through-hole electrode substrate

Package substrates with magnetic build-up layers

Package structure with a barrier layer and method for forming the same

Through-hole electrode substrate

Through-hole electrode substrate

Chip bonding apparatus, chip bonding method and a chip package stru...

Semiconductor device, display panel assembly, semiconductor structure

3D integrated DC-DC power converters

Electronic package with narrow-factor via including finish layer

Contact arrangements for stackable microelectronic package structur...

Stackable semiconductor package and manufacturing method thereof

Semiconductor device and method of forming flipchip interconnection...

Substrate comprising inorganic material that lowers the coefficient...

High-frequency switch

Semiconductor package including a stacking element

Semiconductor package having an internal cooling system

Reducing the switching noise on substrate with high grounding resis...

Semiconductor package having an internal cooling system

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE

PACKAGE STRUCTURE WITH A BARRIER LAYER

SEMICONDUCTOR PACKAGE

FILTERING STRUCTURE AND ELECTRONIC DEVICE

Architecture for Computing System Package

SEMICONDUCTOR DEVICE AND EQUIPMENT

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...

Architecture for Computing System Package

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...

FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID

SEMICONDUCTOR DEVICE, DISPLAY PANEL ASSEMBLY, SEMICONDUCTOR STRUCTURE

ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER

SUBSTRATE COMPRISING INORGANIC MATERIAL THAT LOWERS THE COEFFICIENT...

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM

HIGH-FREQUENCY SWITCH

Semiconductor Device and Method of Forming Flipchip Interconnection...

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM