the bump connectors being bonded to at least one common bonding area

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H01L2224/17106

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/17106the bump connectors being bonded to at least one common bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finer grain dynamic random access memory
- Patent number 11,791,317
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 11,764,158
- Issue date Sep 19, 2023
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 11,677,059
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finer grain dynamic random access memory
- Patent number 11,527,510
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing a high voltage transistor with a field plate
- Patent number 11,302,785
- Issue date Apr 12, 2022
- Texas Instruments Incorporated
- Ramana Tadepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithotgraphica...
- Patent number 11,043,457
- Issue date Jun 22, 2021
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 10,971,668
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 10,892,391
- Issue date Jan 12, 2021
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating conductive traces and resulting structures
- Patent number 10,811,313
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly for reusable surgical instruments
- Patent number 10,811,816
- Issue date Oct 20, 2020
- Covidien LP
- Christopher Penna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module, electronic device, and method for contr...
- Patent number 10,756,011
- Issue date Aug 25, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,720,410
- Issue date Jul 21, 2020
- TOSHIBA MEMORY CORPORATION
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectivity of die to a host substrate
- Patent number 10,707,160
- Issue date Jul 7, 2020
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 10,707,168
- Issue date Jul 7, 2020
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,580,750
- Issue date Mar 3, 2020
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stacked semiconductor chips
- Patent number 10,483,243
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stacked semiconductor chips
- Patent number 10,199,355
- Issue date Feb 5, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,115,703
- Issue date Oct 30, 2018
- TOSHIBA MEMORY CORPORATION
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a dense arrangement of contact terminals
- Patent number 10,090,251
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor package and method...
- Patent number 10,002,843
- Issue date Jun 19, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state device including a conductive bump connected to a metal...
- Patent number 9,966,332
- Issue date May 8, 2018
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectivity of die to a host substrate
- Patent number 9,831,168
- Issue date Nov 28, 2017
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 9,812,405
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20220216183
- Publication date Jul 7, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Mingxing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE TRANSISTOR WITH A FIELD PLATE
- Publication number 20220216309
- Publication date Jul 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Ramana Tadepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE PACKAGE
- Publication number 20200058839
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190006324
- Publication date Jan 3, 2019
- Toshiba Memory Corporation
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE
- Publication number 20180076124
- Publication date Mar 15, 2018
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Devices Including Stacked Semiconductor Chips
- Publication number 20170154873
- Publication date Jun 1, 2017
- Samsung Electronics Co., Ltd.
- Donghyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170148760
- Publication date May 25, 2017
- SONY CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...
- Publication number 20170110434
- Publication date Apr 20, 2017
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20160372442
- Publication date Dec 22, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Bing Han
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD...
- Publication number 20160284659
- Publication date Sep 29, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20150364425
- Publication date Dec 17, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150171064
- Publication date Jun 18, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE
- Publication number 20140217565
- Publication date Aug 7, 2014
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP STACKING STRUCTURE
- Publication number 20140177189
- Publication date Jun 26, 2014
- Chang-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD
- Publication number 20140124914
- Publication date May 8, 2014
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- CHANG-MING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING DECOUPLING DEVICES INSIDE A TSV DRAM STACK
- Publication number 20140117500
- Publication date May 1, 2014
- International Business Machines Corporation
- Joab D. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING DECOUPLING DEVICES INSIDE A TSV DRAM STACK
- Publication number 20130313705
- Publication date Nov 28, 2013
- International Business Machines Corporation
- Joab D. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20130285257
- Publication date Oct 31, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130248916
- Publication date Sep 26, 2013
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Direct Connections to Through Vias
- Publication number 20130241057
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MA...
- Publication number 20130154119
- Publication date Jun 20, 2013
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS

the bump connectors being bonded to at least one common bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device multilevel package substrate for improved electro...

Die attached leveling control by metal stopper bumps

Finer grain dynamic random access memory

Embedded multi-die interconnect bridge packages with lithographical...

Light-emitting device package including a lead frame

Finer grain dynamic random access memory

Semiconductor package and method for manufacturing the same

Method for testing a high voltage transistor with a field plate

Semiconductor packages with an intermetallic layer

Embedded multi-die interconnect bridge packages with lithotgraphica...

Light-emitting device package including a lead frame

Light-emitting device package including a lead frame

Methods of fabricating conductive traces and resulting structures

Chip assembly for reusable surgical instruments

Power semiconductor module, electronic device, and method for contr...

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Electrical connectivity of die to a host substrate

Embedded multi-die interconnect bridge packages with lithographical...

Electronic component

Semiconductor devices including stacked semiconductor chips

Microelectronic die packages with metal leads, including metal lead...

Semiconductor devices including stacked semiconductor chips

Semiconductor device and manufacturing method thereof

Semiconductor chip having a dense arrangement of contact terminals

Microelectronic die packages with metal leads, including metal lead...

Semiconductor substrate structure, semiconductor package and method...

Solid-state device including a conductive bump connected to a metal...

Electrical connectivity of die to a host substrate

Semiconductor package and manufacturing method of the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DISPLAY SUBSTRATE AND DISPLAY DEVICE

HIGH VOLTAGE TRANSISTOR WITH A FIELD PLATE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE

Semiconductor Devices Including Stacked Semiconductor Chips

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...

DISPLAY DEVICE

SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD...

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE

CHIP STACKING STRUCTURE

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD

IMPLEMENTING DECOUPLING DEVICES INSIDE A TSV DRAM STACK

IMPLEMENTING DECOUPLING DEVICES INSIDE A TSV DRAM STACK

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...

SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME

Methods and Apparatus for Direct Connections to Through Vias

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MA...