the capacitor being in a substrate trench

Industry

CPC
H01L27/10829

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/10829the capacitor being in a substrate trench

Industries

Patents Grantslast 30 patents

Information Patent Grant
Minimizing shorting between FinFET epitaxial regions
- Patent number 11,664,375
- Issue date May 30, 2023
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure and capacitor structure
- Patent number 11,651,896
- Issue date May 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,652,101
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising compensation capacitors
- Patent number 11,637,105
- Issue date Apr 25, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,631,679
- Issue date Apr 18, 2023
- United Microelectronics Corp.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,563,009
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jenn-Gwo Hwu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory device and method of fabricating the same
- Patent number 11,538,823
- Issue date Dec 27, 2022
- Chen-Chih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit devices and methods of manufacturing same
- Patent number 11,482,285
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Sung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for manufacturing the same
- Patent number 11,476,056
- Issue date Oct 18, 2022
- Murata Manufacturing Co., Ltd.
- Hiroshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 11,411,004
- Issue date Aug 9, 2022
- Samsung Electronics Co., Ltd.
- Yanghee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,411,073
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising vertically-alternating tiers of insulative...
- Patent number 11,411,002
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric based transistors
- Patent number 11,398,568
- Issue date Jul 26, 2022
- GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG
- Patrick Polakowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,393,826
- Issue date Jul 19, 2022
- United Microelectronics Corp.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FFT-dram
- Patent number 11,373,696
- Issue date Jun 28, 2022
- NIF/T, LLC
- Mammen Thomas
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory structure
- Patent number 11,367,727
- Issue date Jun 21, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure
- Patent number 11,367,728
- Issue date Jun 21, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabricating method thereof
- Patent number 11,362,039
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a gate structure portion in a word line
- Patent number 11,342,335
- Issue date May 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Szu-Yao Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,271,000
- Issue date Mar 8, 2022
- United Microelectronics Corp.
- Bo-Ruei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for fabricating thereof
- Patent number 11,244,946
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Chang Mu An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with air gap and method for preparin...
- Patent number 11,217,591
- Issue date Jan 4, 2022
- NANYA TECHNOLOGY CORPORATION
- Chin-Te Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile random access memory (NVRAM)
- Patent number 11,205,680
- Issue date Dec 21, 2021
- NXP USA, INC.
- Anirban Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,201,205
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of capacitors, methods used in forming integrated circuitry,...
- Patent number 11,195,838
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Scott L. Light
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of capacitors, an array of memory cells, a method of forming...
- Patent number 11,177,266
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atom implantation for passivation of pillar material
- Patent number 11,164,876
- Issue date Nov 2, 2021
- Micron Technology, Inc.
- Russell A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising compensation capacitors and related memory dev...
- Patent number 11,158,640
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including vertical capacitors
- Patent number 11,152,068
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Xiang-Zheng Bo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure having transistors and capacitor and manufacturing...
- Patent number 11,152,370
- Issue date Oct 19, 2021
- Powerchip Semiconductor Manufacturing Corporation
- Yu-An Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAP...
- Publication number 20240107749
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240057318
- Publication date Feb 15, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Li-Peng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240030359
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS
- Publication number 20230387330
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STR...
- Publication number 20230328955
- Publication date Oct 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xingsong SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY AND MEMORY FORMING METHOD
- Publication number 20230292485
- Publication date Sep 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL STRUCTURE, MEMORY ARRAY STRUCTURE, SEMICONDUCTOR STRUCT...
- Publication number 20230262964
- Publication date Aug 17, 2023
- Changxin Memory Technologies, Inc.
- Guangsu SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICES WITH STRONTIUM TITANATE INSULATOR LAYERS
- Publication number 20230253444
- Publication date Aug 10, 2023
- Intel Corporation
- Arnab Sen Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR FABRICATING A VERTICAL DRAM STRUCTURE
- Publication number 20230255014
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE HAVING MEMORY CELL WITH REDUC...
- Publication number 20230240061
- Publication date Jul 27, 2023
- NANYA TECHNOLOGY CORPORATION
- CHING-KAI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PLUG FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...
- Publication number 20230240065
- Publication date Jul 27, 2023
- HeFeChip Corporation Limited
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING MEMORY CELL WITH REDUCED PROTRUSION
- Publication number 20230240064
- Publication date Jul 27, 2023
- NANYA TECHNOLOGY CORPORATION
- CHING-KAI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS IN STAGGERED LAYOUTS
- Publication number 20230133520
- Publication date May 4, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230055202
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jinghao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFA...
- Publication number 20230051597
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS
- Publication number 20220399343
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Wooyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CH...
- Publication number 20220359529
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Vertically-Alternating Tiers of Insulative...
- Publication number 20220352167
- Publication date Nov 3, 2022
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD FOR MEMORY AND MEMORY
- Publication number 20220352177
- Publication date Nov 3, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Junchao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220344345
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Yanghee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20220336466
- Publication date Oct 20, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Longyang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FFT-DRAM
- Publication number 20220319567
- Publication date Oct 6, 2022
- NIF/T, LLC
- Mammen Thomas
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FORMING FILM LAYER WITH UNIFORM THICKNESS DISTRIBUTION A...
- Publication number 20220310618
- Publication date Sep 29, 2022
- ChangXin Memory Technologies, Inc.
- Tao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE STRUCTURE
- Publication number 20220310779
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220271037
- Publication date Aug 25, 2022
- UNITED MICROELECTRONICS CORP.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220238530
- Publication date Jul 28, 2022
- NANYA TECHNOLOGY CORPORATION
- Szu-Yao CHANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220181327
- Publication date Jun 9, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xingsong SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE MANUFACTURING M...
- Publication number 20220173111
- Publication date Jun 2, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuhan ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THEREOF
- Publication number 20220130835
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Chang Mu An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FORMATION METHOD AND SEMICONDUCTOR STRUCTURE
- Publication number 20220130836
- Publication date Apr 28, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Longyang CHEN
- H01 - BASIC ELECTRIC ELEMENTS

the capacitor being in a substrate trench

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Minimizing shorting between FinFET epitaxial regions

Method of manufacturing capacitor structure and capacitor structure

Trench capacitor assembly for high capacitance density

Apparatus comprising compensation capacitors

Semiconductor device

Semiconductor memory device

Dynamic random access memory device and method of fabricating the same

Integrated circuit devices and methods of manufacturing same

Capacitor and method for manufacturing the same

Semiconductor devices and methods of manufacturing the same

Semiconductor package device and method for manufacturing the same

Memory arrays comprising vertically-alternating tiers of insulative...

Ferroelectric based transistors

Semiconductor device and method of forming the same

FFT-dram

Memory structure

Memory structure

Semiconductor structure and fabricating method thereof

Semiconductor structure having a gate structure portion in a word line

Method for fabricating semiconductor device

Semiconductor devices and methods for fabricating thereof

Semiconductor device structure with air gap and method for preparin...

Non-volatile random access memory (NVRAM)

Interconnect layout for semiconductor device

Arrays of capacitors, methods used in forming integrated circuitry,...

Array of capacitors, an array of memory cells, a method of forming...

Atom implantation for passivation of pillar material

Apparatus comprising compensation capacitors and related memory dev...

Integrated circuit including vertical capacitors

Memory structure having transistors and capacitor and manufacturing...

Patents Applicationslast 30 patents

ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAP...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STR...

MEMORY AND MEMORY FORMING METHOD

MEMORY CELL STRUCTURE, MEMORY ARRAY STRUCTURE, SEMICONDUCTOR STRUCT...

CAPACITOR DEVICES WITH STRONTIUM TITANATE INSULATOR LAYERS

TECHNOLOGIES FOR FABRICATING A VERTICAL DRAM STRUCTURE

METHOD OF MANUFACTURING MEMORY DEVICE HAVING MEMORY CELL WITH REDUC...

METHOD OF FORMING PLUG FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...

MEMORY DEVICE HAVING MEMORY CELL WITH REDUCED PROTRUSION

MEMORY DEVICES HAVING VERTICAL TRANSISTORS IN STAGGERED LAYOUTS

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFA...

SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS

SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CH...

Memory Arrays Comprising Vertically-Alternating Tiers of Insulative...

MANUFACTURING METHOD FOR MEMORY AND MEMORY

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

FFT-DRAM

METHOD FOR FORMING FILM LAYER WITH UNIFORM THICKNESS DISTRIBUTION A...

CAPACITANCE STRUCTURE

SEMICONDUCTOR DEVICE

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE MANUFACTURING M...

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THEREOF

SEMICONDUCTOR STRUCTURE FORMATION METHOD AND SEMICONDUCTOR STRUCTURE