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last 30 patents
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Info packages including thermal dissipation blocks
Patent number
12,368,148
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming semiconductor packages
Patent number
12,368,149
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Jan Pei
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and manufacturing method thereof
Patent number
12,368,084
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
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Supporting InFO packages to reduce warpage
Patent number
12,368,115
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
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High bandwidth die to die interconnect with package area reduction
Patent number
12,368,137
Issue date
Jul 22, 2025
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
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Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
12,362,260
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
12,362,309
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and method of manufacturing semiconductor pac...
Patent number
12,362,326
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Method of forming packages of stacked chips
Patent number
12,362,327
Issue date
Jul 15, 2025
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method
Patent number
12,362,291
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
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Chip package assembly, electronic device, and preparation method of...
Patent number
12,354,967
Issue date
Jul 8, 2025
Huawei Technologies Co., Ltd.
Zhaozheng Hou
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacture
Patent number
12,354,969
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Package and method for manufacturing the same
Patent number
12,354,926
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Reconstituted substrate structure and fabrication methods for heter...
Patent number
12,354,968
Issue date
Jul 8, 2025
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package including photo imageable dielectric
Patent number
12,354,974
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Yuseon Heo
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor packages
Patent number
12,347,749
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Package assembly and manufacturing method thereof
Patent number
12,345,935
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
12,347,739
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
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Microelectronic assemblies with direct attach to circuit boards
Patent number
12,347,782
Issue date
Jul 1, 2025
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and method manufacturing the same
Patent number
12,347,785
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
12,341,106
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Wen Lin
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacturing thereof
Patent number
12,341,107
Issue date
Jun 24, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yi Seul Han
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and manufacturing method thereof
Patent number
12,334,424
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Ming Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Package structure including photonic package having embedded optica...
Patent number
12,334,362
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Encapsulated package including device dies connected via interconne...
Patent number
12,334,464
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,334,450
Issue date
Jun 17, 2025
Amkor Technology Singapore Holding Pte Ltd.
Jin Seong Kim
H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package
Patent number
12,334,457
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with discrete blocks
Patent number
12,334,476
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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Logic drive based on chip scale package comprising standardized com...
Patent number
12,327,816
Issue date
Jun 10, 2025
iCometrue Company Ltd.
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
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High density substrate routing in package
Patent number
12,327,807
Issue date
Jun 10, 2025
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250239537
Publication date
Jul 24, 2025
ROHM CO., LTD.
Kazunori FUJI
H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
Publication number
20250239534
Publication date
Jul 24, 2025
Innolux Corporation
Jen-Hai Chi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20250239536
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...
Publication number
20250239535
Publication date
Jul 24, 2025
IBIDEN CO., LTD.
Yuichi NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
Publication number
20250233301
Publication date
Jul 17, 2025
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
Publication number
20250226332
Publication date
Jul 10, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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HYBRID BONDING STRUCTURE AND DISPLAY PANEL
Publication number
20250219033
Publication date
Jul 3, 2025
Industrial Technology Research Institute
Jui-Wen Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Packages And Methods Of Forming The Same
Publication number
20250219024
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20250210569
Publication date
Jun 26, 2025
Shinko Electric Industries Co., Ltd.
Takumi Yumoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
Publication number
20250210536
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Heh-Chang HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
Publication number
20250210852
Publication date
Jun 26, 2025
QUALCOMM Incorporated
Ranadeep DUTTA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PLATE SHAPED SUBSTRATE AND PACKAGING SUBSTRATE
Publication number
20250210423
Publication date
Jun 26, 2025
ABSOLICS INC.
SeHan YUN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
STACKED PACKAGE DEVICE WITH INTERCONNECTED CONDUCTIVE BUMPS
Publication number
20250210482
Publication date
Jun 26, 2025
Powertech Technology Inc.
HUNG HSIN HSU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SYSTEMS AND METHODS FOR HIGH DENSITY SYSTEM ON CHIP MEMORY INTEGRATION
Publication number
20250212422
Publication date
Jun 26, 2025
Meta Platforms Technologies, LLC
Rajendra D. Pendse
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...
Publication number
20250189889
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Sih-Hao Liao
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
Publication number
20250192080
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
Publication number
20250183191
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20250174612
Publication date
May 29, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyun Goo Cha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
Publication number
20250174509
Publication date
May 29, 2025
INFINEON TECHNOLOGIES AG
Angela Kessler
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
Publication number
20250167173
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
Publication number
20250167183
Publication date
May 22, 2025
Intel Corporation
David O'SULLIVAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
Publication number
20250157956
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
Publication number
20250157940
Publication date
May 15, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
Publication number
20250157941
Publication date
May 15, 2025
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Scalable Large System Based on Organic Interconnect
Publication number
20250157936
Publication date
May 15, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED DIE ON INTERPOSER PACKAGES
Publication number
20250149462
Publication date
May 8, 2025
Intel Corporation
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250149491
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
Publication number
20250149505
Publication date
May 8, 2025
iCometrue Company Ltd.
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH ACTIVE SILICON BRIDGE
Publication number
20250149525
Publication date
May 8, 2025
ADVANCED MICRO DEVICES, INC.
Deepak Vasant KULKARNI
H01 - BASIC ELECTRIC ELEMENTS