the compound being a silane

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H01L21/02211

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02211the compound being a silane

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Patents Grantslast 30 patents

Information Patent Grant
Method for depositing film and film deposition system
- Patent number 12,205,817
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,191,377
- Issue date Jan 7, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Jun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying temperature anneal for film and structures formed thereby
- Patent number 12,176,206
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate structure and method of manufacturing...
- Patent number 12,170,280
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,142,668
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chalcogen precursors for deposition of silicon nitride
- Patent number 12,142,477
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Chandan Kr Barik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing blocking layers on metal surfaces
- Patent number 12,131,900
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of deposition
- Patent number 12,131,899
- Issue date Oct 29, 2024
- SPTS Technology Limited
- Tristan Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF pulsing assisted low-k film deposition with high mechanical stre...
- Patent number 12,125,675
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PEALD nitride films
- Patent number 12,119,221
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 12,116,666
- Issue date Oct 15, 2024
- Kokusai Electric Corporation
- Daigi Kamimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact features of semiconductor devices
- Patent number 12,112,984
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen-rich silicon nitride films for thin film transistors
- Patent number 12,094,796
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Rodney S. Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, rec...
- Patent number 12,094,708
- Issue date Sep 17, 2024
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch stop layer
- Patent number 12,087,572
- Issue date Sep 10, 2024
- Lam Research Corporation
- Bart J. van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum pump protection against deposition byproduct buildup
- Patent number 12,087,561
- Issue date Sep 10, 2024
- Lam Research Corporation
- John Stephen Drewery
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxidative conversion in atomic layer deposition processes
- Patent number 12,087,574
- Issue date Sep 10, 2024
- Lam Research Corporation
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect system with improved low-K dielectrics
- Patent number 12,080,547
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,074,021
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 12,074,058
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of SiOC thin films
- Patent number 12,068,156
- Issue date Aug 20, 2024
- ASM IP Holding B.V.
- Jan Willem Maes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic sige:b epitaxial film growth for gate all around transi...
- Patent number 12,068,155
- Issue date Aug 20, 2024
- Applied Materials, Inc.
- Chen-Ying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch and selective deposition process for extreme ultr...
- Patent number 12,062,538
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an extra low-k dielectric layer and met...
- Patent number 12,062,613
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device, manufacturing method for semiconductor...
- Patent number 12,062,546
- Issue date Aug 13, 2024
- Kokusai Electric Corporation
- Hidenari Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning member in process container, method of manufactu...
- Patent number 12,053,805
- Issue date Aug 6, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Compositions and methods using same for deposition of silicon-conta...
- Patent number 12,049,695
- Issue date Jul 30, 2024
- VERSUM MATERIALS US, LLC
- Raymond Nicholas Vrtis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal silicon-germanium film deposition
- Patent number 12,046,468
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,040,179
- Issue date Jul 16, 2024
- Kokusai Electric Corporation
- Takaaki Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modulated atomic layer deposition
- Patent number 12,040,181
- Issue date Jul 16, 2024
- Lam Research Corporation
- Chan Myae Myae Soe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Method, Method of Manufacturing Semiconductor...
- Publication number 20250014894
- Publication date Jan 9, 2025
- Kokusai Electric Corporation
- Hiroki HATTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF
- Publication number 20250014890
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...
- Publication number 20250014895
- Publication date Jan 9, 2025
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP
- Publication number 20250006489
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Ranjit Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
- Publication number 20240429045
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395902
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH INCREASED ETCH...
- Publication number 20240387167
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Shanshan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN
- Publication number 20240379347
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- Mikko Ruoho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SYSTEM WITH IMPROVED LOW-K DIELECTRICS
- Publication number 20240363336
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS
- Publication number 20240363337
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240363338
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING MEMBER IN PROCESS CONTAINER, METHOD OF MANUFACTU...
- Publication number 20240359218
- Publication date Oct 31, 2024
- Kokusai Electric Corporation
- Koei KURIBAYASHI
- B08 - CLEANING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355642
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20240347337
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES FOR DEPOSITING SIB FILMS
- Publication number 20240339316
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Aykut AYDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY
- Publication number 20240332005
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Wenhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CONTACT ETCHING WITH ADDITIVE GAS
- Publication number 20240332029
- Publication date Oct 3, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATED ATOMIC LAYER DEPOSITION
- Publication number 20240332007
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Chan Myae Myae Soe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...
- Publication number 20240318311
- Publication date Sep 26, 2024
- ASM IP HOLDING B.V.
- Agung Setiadi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240321596
- Publication date Sep 26, 2024
- Kokusai Electric Corporation
- Masanao Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES TO DEPOSIT AMORPHOUS-SILICON ETCH PROTECTION LINER
- Publication number 20240321589
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND MANUFACTURING METHOD OF A SEMICONDUCTOR MEMORY D...
- Publication number 20240321570
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Ayata HARAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...
- Publication number 20240309507
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Fayaz Shaikh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20240304438
- Publication date Sep 12, 2024
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MAN...
- Publication number 20240297038
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PRECURSORS FOR SILICON NITRIDE DEPOSITION
- Publication number 20240297039
- Publication date Sep 5, 2024
- ASM IP HOLDING B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the compound being a silane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for depositing film and film deposition system

Method for forming a semiconductor structure

Varying temperature anneal for film and structures formed thereby

Method of manufacturing gate structure and method of manufacturing...

Semiconductor device and method

Chalcogen precursors for deposition of silicon nitride

Methods for depositing blocking layers on metal surfaces

Method of deposition

RF pulsing assisted low-k film deposition with high mechanical stre...

PEALD nitride films

Substrate processing apparatus and method of manufacturing semicond...

Contact features of semiconductor devices

Nitrogen-rich silicon nitride films for thin film transistors

Method of processing substrate, substrate processing apparatus, rec...

Etch stop layer

Vacuum pump protection against deposition byproduct buildup

Oxidative conversion in atomic layer deposition processes

Interconnect system with improved low-K dielectrics

Semiconductor device and method of forming the same

Patterning methods for semiconductor devices

Selective deposition of SiOC thin films

Anisotropic sige:b epitaxial film growth for gate all around transi...

Atomic layer etch and selective deposition process for extreme ultr...

Semiconductor device having an extra low-k dielectric layer and met...

Substrate processing device, manufacturing method for semiconductor...

Method of cleaning member in process container, method of manufactu...

Compositions and methods using same for deposition of silicon-conta...

Conformal silicon-germanium film deposition

Method of manufacturing semiconductor device, substrate processing...

Modulated atomic layer deposition

Patents Applicationslast 30 patents

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

Substrate Processing Method, Method of Manufacturing Semiconductor...

CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF

METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...

METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SEMICONDUCTOR DEVICE AND METHOD

DEVICE AND METHOD OF FORMING THE SAME

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH INCREASED ETCH...

SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

INTERCONNECT SYSTEM WITH IMPROVED LOW-K DIELECTRICS

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD OF CLEANING MEMBER IN PROCESS CONTAINER, METHOD OF MANUFACTU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LOW-K ALD GAP-FILL METHODS AND MATERIAL

PROCESSES FOR DEPOSITING SIB FILMS

METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY

HIGH ASPECT RATIO CONTACT ETCHING WITH ADDITIVE GAS

MODULATED ATOMIC LAYER DEPOSITION

METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

PROCESSES TO DEPOSIT AMORPHOUS-SILICON ETCH PROTECTION LINER

ETCHING METHOD AND MANUFACTURING METHOD OF A SEMICONDUCTOR MEMORY D...

PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...

DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MAN...

SILICON PRECURSORS FOR SILICON NITRIDE DEPOSITION