the compound being a silane

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02211the compound being a silane

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,365,987
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal deposition of silicon carbide films using heterogeneous p...
- Patent number 12,359,311
- Issue date Jul 15, 2025
- Lam Research Corporation
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low temperature silicon nitride films
- Patent number 12,362,169
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wenbo Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method, recording medium, and substrate proces...
- Patent number 12,351,908
- Issue date Jul 8, 2025
- Kokusai Electric Corporation
- Takeo Hanashima
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Information Patent Grant
Ultrathin atomic layer deposition film accuracy thickness control
- Patent number 12,354,871
- Issue date Jul 8, 2025
- Lam Research Corporation
- Jun Qian
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Information Patent Grant
Methods and systems for topography-selective depositions
- Patent number 12,347,675
- Issue date Jul 1, 2025
- ASM IP Holding B.V.
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
MOCVD method for growing INALGAN/GAN heterostructure
- Patent number 12,347,678
- Issue date Jul 1, 2025
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Edward Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacer and formation method thereof
- Patent number 12,336,249
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Rui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for fabricating staircase regions of a three...
- Patent number 12,334,399
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiongyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin film deposition process
- Patent number 12,322,591
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Naoki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of silicon-based dielectric films
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- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Geetika Bajaj
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Information Patent Grant
Semiconductor device and method
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- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
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- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal and smooth titanium nitride layers and methods of forming...
- Patent number 12,308,226
- Issue date May 20, 2025
- Eugenus, Inc.
- Sung-Hoon Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with multilayer insulating layer in recess and...
- Patent number 12,300,614
- Issue date May 13, 2025
- Kioxia Corporation
- Kosuke Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure with a composite stress layer and reduced fin buck...
- Patent number 12,302,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced film formation method
- Patent number 12,300,466
- Issue date May 13, 2025
- Tokyo Electron Limited
- Toshihiko Iwao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing gap filling fluids and related systems and d...
- Patent number 12,293,942
- Issue date May 6, 2025
- ASM IP Holding B.V.
- Timothee Blanquart
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Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,288,814
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing blocking layers on conductive surfaces
- Patent number 12,281,382
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Lakmal C. Kalutarage
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Information Patent Grant
Substrate processing method
- Patent number 12,283,479
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- JaeOk Ko
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Information Patent Grant
Manufacturing method for compound semiconductor device
- Patent number 12,283,922
- Issue date Apr 22, 2025
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method, method of manufacturing semiconductor device, pr...
- Patent number 12,283,478
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Station-to-station control of backside bow compensation deposition
- Patent number 12,272,608
- Issue date Apr 8, 2025
- Lam Research Corporation
- Yanhui Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 12,272,547
- Issue date Apr 8, 2025
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
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Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide-nitride-oxide stack having multiple oxynitride layers
- Patent number 12,266,521
- Issue date Apr 1, 2025
- LONGITUDE FLASH MEMORY SOLUTIONS LTD.
- Sagy Charel Levy
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,266,728
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS
- Publication number 20250232992
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Yao HSIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...
- Publication number 20250233017
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- WONIK IPS CO., LTD.
- Chang Gyu SONG
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250226206
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Daigo YAMAGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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ENHANCED DEUTERIUM MIGRATION
- Publication number 20250226203
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Madhu Santosh Kumar Mutyala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20250226204
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Yoshitomo HASHIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS AND APPARATUSES FOR FILLING A GAP
- Publication number 20250226214
- Publication date Jul 10, 2025
- ASM IP HOLDING B.V.
- Ranjit Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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INTEGRATED CIRCUIT (IC) WITH DOPANT PROFILE CONTROL IN A HETEROJUNC...
- Publication number 20250220936
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Tatsuya Tominari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES
- Publication number 20250207246
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Ian John CURTIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...
- Publication number 20250210347
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Zhijie Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...
- Publication number 20250197996
- Publication date Jun 19, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECURSOR FOR FORMING SILICON-CONTAINING THIN FILM WITH HIGH HARDNE...
- Publication number 20250201549
- Publication date Jun 19, 2025
- EGTM Co., Ltd.
- Sung Jun Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...
- Publication number 20250201548
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Zhijie Chua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THIN FILM TRANSISTOR
- Publication number 20250204051
- Publication date Jun 19, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compositions and Methods Using Same for Deposition of Silicon-Conta...
- Publication number 20250188605
- Publication date Jun 12, 2025
- VERSUM MATERIALS US, LLC
- Jianheng Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...
- Publication number 20250183029
- Publication date Jun 5, 2025
- VERSUM MATERIALS US, LLC
- Mark Leonard O'Neill
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250183028
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CVD OF TITANIUM SILICIDE METHODS TO FORM SEMICONDUCTOR STRU...
- Publication number 20250174456
- Publication date May 29, 2025
- Applied Materials, Inc.
- Shumao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL FILM DEPOSITION
- Publication number 20250166989
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- Jason Alexander Varnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...
- Publication number 20250149328
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Bhadri N. VARADARAJAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS TO IMPROVE OXIDE SIDEWALL QUALITY
- Publication number 20250125145
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Tianyang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECT...
- Publication number 20250112038
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Shanshan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM-FREE SINGLE OPERATION AMORPHOUS SILICON GAP FILL
- Publication number 20250112039
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- John Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...
- Publication number 20250112041
- Publication date Apr 3, 2025
- Gelest, Inc.
- Chad Michael BRICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...
- Publication number 20250095982
- Publication date Mar 20, 2025
- Gelest, Inc.
- Chad Michael BRICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SILICON NITRIDE FILMS
- Publication number 20250087477
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Joseph AuBuchon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-FORMING METHOD AND FILM-FORMING APPARATUS
- Publication number 20250084530
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Yohei MATSUYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250081492
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Lin CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE
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- Publication date Mar 6, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Jun Wu
- H01 - BASIC ELECTRIC ELEMENTS

the compound being a silane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing substrate, method of manufacturing semiconduct...

Conformal deposition of silicon carbide films using heterogeneous p...

Methods and apparatus for low temperature silicon nitride films

Substrate processing method, recording medium, and substrate proces...

Ultrathin atomic layer deposition film accuracy thickness control

Methods and systems for topography-selective depositions

MOCVD method for growing INALGAN/GAN heterostructure

Gate spacer and formation method thereof

Structures and methods for fabricating staircase regions of a three...

Remote plasma based deposition of silicon carbide films using silic...

Thin film deposition process

Deposition of silicon-based dielectric films

Semiconductor device and method

Method of fabricating a semiconductor device

Conformal and smooth titanium nitride layers and methods of forming...

Semiconductor device with multilayer insulating layer in recess and...

FinFET structure with a composite stress layer and reduced fin buck...

Plasma enhanced film formation method

Semiconductor device with self-aligned vias

Methods for depositing gap filling fluids and related systems and d...

Semiconductor device and method of manufacture

Methods for depositing blocking layers on conductive surfaces

Substrate processing method

Manufacturing method for compound semiconductor device

Processing method, method of manufacturing semiconductor device, pr...

Station-to-station control of backside bow compensation deposition

Conformal deposition of silicon carbide films

Semiconductor device and methods of manufacture

Oxide-nitride-oxide stack having multiple oxynitride layers

Semiconductor device and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS

GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

ENHANCED DEUTERIUM MIGRATION

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

METHODS AND APPARATUSES FOR FILLING A GAP

INTEGRATED CIRCUIT (IC) WITH DOPANT PROFILE CONTROL IN A HETEROJUNC...

REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES

METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...

LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...

PRECURSOR FOR FORMING SILICON-CONTAINING THIN FILM WITH HIGH HARDNE...

METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...

THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THIN FILM TRANSISTOR

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

Compositions and Methods Using Same for Deposition of Silicon-Conta...

ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

THERMAL CVD OF TITANIUM SILICIDE METHODS TO FORM SEMICONDUCTOR STRU...

THERMAL FILM DEPOSITION

REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...

METHODS TO IMPROVE OXIDE SIDEWALL QUALITY

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECT...

SEAM-FREE SINGLE OPERATION AMORPHOUS SILICON GAP FILL

INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...

INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC...

METHODS OF FORMING SILICON NITRIDE FILMS

FILM-FORMING METHOD AND FILM-FORMING APPARATUS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE