the conductive layers comprising transition metals

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H01L21/28568

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/28568the conductive layers comprising transition metals

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ruthenium film forming method and substrate processing system
- Patent number 12,227,841
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-controlled surface with a cryo-nanomanipulator for impr...
- Patent number 12,230,473
- Issue date Feb 18, 2025
- Applied Materials Israel Ltd.
- Yehuda Zur
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,327
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for forming semiconductor devices containin...
- Patent number 12,217,965
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Fei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside ohmic contacts for semiconductor devices
- Patent number 12,211,920
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,195,853
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Motonari Takebayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact metallization process
- Patent number 12,191,199
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition method and element including film deposited by the...
- Patent number 12,183,582
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transition metal containing film on a substrate...
- Patent number 12,173,402
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Timo Hatanpää
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,170,206
- Issue date Dec 17, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and a manufacturing method thereof
- Patent number 12,166,133
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selective deposition
- Patent number 12,157,943
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Wenjing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,148,621
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of tungsten on molybdenum templates
- Patent number 12,148,623
- Issue date Nov 19, 2024
- Lam Research Corporation
- Patrick A. van Cleemput
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method
- Patent number 12,119,228
- Issue date Oct 15, 2024
- ASM IP Holding B.V.
- Chiyu Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Memories having vertically stacked conductive filled structures
- Patent number 12,114,492
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Butted contacts and methods of fabricating the same in semiconducto...
- Patent number 12,094,942
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,084,757
- Issue date Sep 10, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite work function layer formation using same work function ma...
- Patent number 12,080,777
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS
- Publication number 20250054748
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Guangyan Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION
- Publication number 20250029840
- Publication date Jan 23, 2025
- LAM RESEARCH CORPORATION
- Patrick A. VAN CLEEMPUT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250019827
- Publication date Jan 16, 2025
- Soulbrain Co., LTD
- Chang Bong YEON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION METHOD
- Publication number 20240429055
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Chiyu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20240407160
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molybdenum-Containing Device-Level Interconnects and Methods of Fab...
- Publication number 20240395894
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Chu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT METALLIZATION PROCESS
- Publication number 20240395611
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Pei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240387661
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES
- Publication number 20240387645
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NFET with Aluminum-Free Work-Function Layer and Method Forming Same
- Publication number 20240379777
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD
- Publication number 20240379776
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP METAL NITRIDE FORMATION
- Publication number 20240379368
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- Eric James Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE WORK FUNCTION LAYER FORMATION USING SAME WORK FUNCTION MA...
- Publication number 20240363718
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...
- Publication number 20240355673
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Wei LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Capping Layer For Liner-Free Conductive Structures
- Publication number 20240355741
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355670
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING RESISTIVITY AND CRYSTALLINITY OF LOW-RESISTA...
- Publication number 20240355626
- Publication date Oct 24, 2024
- ULVAC, Inc.
- Chang Min SHIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal Gates and Methods of Forming Thereby
- Publication number 20240347392
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET
- Publication number 20240332402
- Publication date Oct 3, 2024
- Hua Hong Semiconductor (Wuxi) Limited
- Zhaozhao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240334847
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE CAPPING LAYER FOR AREA SELECTIVE DEPOSITION
- Publication number 20240332072
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Andrea Leoncini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240312792
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240304697
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS

the conductive layers comprising transition metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ruthenium film forming method and substrate processing system

Word line structure of three-dimensional memory device

Temperature-controlled surface with a cryo-nanomanipulator for impr...

Dual metal silicide structures for advanced integrated circuit stru...

Semiconductor device and method

Methods and apparatuses for forming semiconductor devices containin...

Method of forming a metal liner for interconnect structures

Backside ohmic contacts for semiconductor devices

Integrated circuits and methods for forming thin film crystal layers

Semiconductor device and method for manufacturing the semiconductor...

Gate line plug structures for advanced integrated circuit structure...

Substrate processing apparatus, method of manufacturing semiconduct...

Plugs for interconnect lines for advanced integrated circuit struct...

Contact metallization process

Film deposition method and element including film deposited by the...

Method of forming a transition metal containing film on a substrate...

Method of processing substrate, method of manufacturing semiconduct...

Semiconductor structure and a manufacturing method thereof

Methods of selective deposition

Tungsten molybdenum structures

Method of processing substrate, method of manufacturing semiconduct...

Deposition of tungsten on molybdenum templates

Contact over active gate structures for advanced integrated circuit...

Methods for forming recesses in source/drain regions and devices fo...

Deposition method

Memories having vertically stacked conductive filled structures

Methods for forming a metallic film on a substrate by cyclical depo...

Butted contacts and methods of fabricating the same in semiconducto...

Method of manufacturing semiconductor device, substrate processing...

Composite work function layer formation using same work function ma...

Patents Applicationslast 30 patents

ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS

TUNGSTEN MOLYBDENUM STRUCTURES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

MOLYBDENUM DEPOSITION

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

DEPOSITION METHOD

Methods of Filling Openings with Conductive Material, and Assemblie...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Molybdenum-Containing Device-Level Interconnects and Methods of Fab...

CONTACT METALLIZATION PROCESS

LOW-RESISTANCE COPPER INTERCONNECTS

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

Semiconductor Device and Method

CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES

NFET with Aluminum-Free Work-Function Layer and Method Forming Same

SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD

BOTTOM-UP METAL NITRIDE FORMATION

COMPOSITE WORK FUNCTION LAYER FORMATION USING SAME WORK FUNCTION MA...

HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...

Capping Layer For Liner-Free Conductive Structures

SEMICONDUCTOR DEVICE

METHOD FOR CONTROLLING RESISTIVITY AND CRYSTALLINITY OF LOW-RESISTA...

Metal Gates and Methods of Forming Thereby

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET

VIA STRUCTURE AND METHODS OF FORMING THE SAME

PROTECTIVE CAPPING LAYER FOR AREA SELECTIVE DEPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...