the conductive layers comprising transition metals

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H01L21/28568

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/28568the conductive layers comprising transition metals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Optimized saddle nozzle design for gas injection system
- Patent number 12,368,019
- Issue date Jul 22, 2025
- Applied Materials Israel Ltd.
- Yehuda Zur
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 12,362,188
- Issue date Jul 15, 2025
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of films using molybdenum precursors
- Patent number 12,351,914
- Issue date Jul 8, 2025
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate structure passivating species drive-in method and structure fo...
- Patent number 12,354,876
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Kuan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor deposition of films comprising molybdenum
- Patent number 12,354,877
- Issue date Jul 8, 2025
- ASM IP Holding B.V.
- Bhushan Zope
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
- Patent number 12,349,450
- Issue date Jul 1, 2025
- Intel Corporation
- Anthony St. Amour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with liner structure
- Patent number 12,341,062
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molybdenum deposition
- Patent number 12,334,351
- Issue date Jun 17, 2025
- Lam Research Corporation
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,334,435
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,336,269
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peng-Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner for V-NAND word line stack
- Patent number 12,328,872
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Jacqueline S. Wrench
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structures having varied materials
- Patent number 12,327,760
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guanyu Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 12,315,863
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced deposition rate by thermal isolation cover for GIS manipul...
- Patent number 12,308,207
- Issue date May 20, 2025
- Applied Materials Israel Ltd.
- Sean Kashy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal chalcogenide film and method and device for manufacturing the...
- Patent number 12,297,532
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Kyung-Eun Byun
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Dual metal wrap-around contacts for semiconductor devices
- Patent number 12,284,820
- Issue date Apr 22, 2025
- Tokyo Electron Limited
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gated heterostructure and double-heterostructure active devices
- Patent number 12,284,817
- Issue date Apr 22, 2025
- MaxPower Semiconductor Inc.
- Jun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal and smooth titanium nitride layers and methods of forming...
- Patent number 12,283,486
- Issue date Apr 22, 2025
- Eugenus, Inc.
- Hyunchol Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method, method of manufacturing semiconductor...
- Patent number 12,278,108
- Issue date Apr 15, 2025
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition for uniform tungsten growth
- Patent number 12,252,783
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Wen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming thin film
- Patent number 12,252,788
- Issue date Mar 18, 2025
- Soulbrain Co., Ltd.
- Changbong Yeon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structure
- Patent number 12,237,322
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nucleation-free tungsten deposition
- Patent number 12,237,221
- Issue date Feb 25, 2025
- Lam Research Corporation
- Sema Ermez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium film forming method and substrate processing system
- Patent number 12,227,841
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-controlled surface with a cryo-nanomanipulator for impr...
- Patent number 12,230,473
- Issue date Feb 18, 2025
- Applied Materials Israel Ltd.
- Yehuda Zur
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,327
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIETHYL ZINC AND METAL HALIDE PRECURSORS FOR DEPOSITION OF METAL FI...
- Publication number 20250230544
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF METAL-CONTAINING FILMS AND CHAMBER CLEAN
- Publication number 20250226227
- Publication date Jul 10, 2025
- LAM RESEARCH CORPORATION
- Dustin Zachary Austin
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250226228
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Mitsuaki IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250218784
- Publication date Jul 3, 2025
- Kokusai Electric Corporation
- Arito OGAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250215563
- Publication date Jul 3, 2025
- Kokusai Electric Corporation
- Takashi YOKOGAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD, SYSTEM AND APPARATUS FOR FORMING A THRESHOLD VOLTAGE SHIFTI...
- Publication number 20250218783
- Publication date Jul 3, 2025
- ASM IP HOLDING B.V.
- Giuseppe Alessio Verni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL PHOSPHIDE DEPOSITION VIA PHOSPHASILANE REACTANTS AND RELATED...
- Publication number 20250207254
- Publication date Jun 26, 2025
- Intel Corporation
- Scott Peter Semproni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250207250
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Tsutomu HIROKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for depositing transition metal carbide
- Publication number 20250188602
- Publication date Jun 12, 2025
- ASM IP HOLDING B.V.
- Paloma Ruiz Y Kärkkäinen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH
- Publication number 20250188601
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Wen CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS
- Publication number 20250183041
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Yao-Tsung HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
- Publication number 20250169190
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUN-LI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20250142939
- Publication date May 1, 2025
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133777
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Wei YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUCLEATION-FREE DEPOSITION
- Publication number 20250132201
- Publication date Apr 24, 2025
- LAM RESEARCH CORPORATION
- Sema ERMEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250118563
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming A Metal Liner For Interconnect Structures
- Publication number 20250112090
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME
- Publication number 20250105013
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Zhaoxuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250069898
- Publication date Feb 27, 2025
- Kokusai Electric Corporation
- Arito OGAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS
- Publication number 20250054748
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Guangyan Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION
- Publication number 20250029840
- Publication date Jan 23, 2025
- LAM RESEARCH CORPORATION
- Patrick A. VAN CLEEMPUT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250019827
- Publication date Jan 16, 2025
- Soulbrain Co., LTD
- Chang Bong YEON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS

the conductive layers comprising transition metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optimized saddle nozzle design for gas injection system

Semiconductor device and method of manufacturing the same

Method for preventing line bending during metal fill process

Deposition of films using molybdenum precursors

Gate structure passivating species drive-in method and structure fo...

Vapor deposition of films comprising molybdenum

Trench plug hardmask for advanced integrated circuit structure fabr...

Method for fabricating semiconductor device with liner structure

Molybdenum deposition

Middle-of-line interconnect structure and manufacturing method

Semiconductor device and manufacturing method thereof

Liner for V-NAND word line stack

Interconnect structures having varied materials

Contact structures in semiconductor devices

Enhanced deposition rate by thermal isolation cover for GIS manipul...

Metal chalcogenide film and method and device for manufacturing the...

Dual metal wrap-around contacts for semiconductor devices

Trench-gated heterostructure and double-heterostructure active devices

Conformal and smooth titanium nitride layers and methods of forming...

Substrate processing method, method of manufacturing semiconductor...

Chemical vapor deposition for uniform tungsten growth

Method for forming thin film

Trench contact structures for advanced integrated circuit structure...

Semiconductor device having fin structure

Nucleation-free tungsten deposition

Ruthenium film forming method and substrate processing system

Word line structure of three-dimensional memory device

Temperature-controlled surface with a cryo-nanomanipulator for impr...

Semiconductor device and method

Dual metal silicide structures for advanced integrated circuit stru...

Patents Applicationslast 30 patents

DIETHYL ZINC AND METAL HALIDE PRECURSORS FOR DEPOSITION OF METAL FI...

DEPOSITION OF METAL-CONTAINING FILMS AND CHAMBER CLEAN

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD, SYSTEM AND APPARATUS FOR FORMING A THRESHOLD VOLTAGE SHIFTI...

METAL PHOSPHIDE DEPOSITION VIA PHOSPHASILANE REACTANTS AND RELATED...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

Method and system for depositing transition metal carbide

CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH

LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

NUCLEATION-FREE DEPOSITION

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...

TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR STRUCTURES

Method Of Forming A Metal Liner For Interconnect Structures

LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS

TUNGSTEN MOLYBDENUM STRUCTURES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

MOLYBDENUM DEPOSITION

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...