the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Industry

CPC
H01L2224/48463

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48463the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Industries

Patents Grantslast 30 patents

Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 11,996,343
- Issue date May 28, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus, manufacturing method of the same, an...
- Patent number 11,991,468
- Issue date May 21, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,894,349
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device isolator with reduced parasitic capacitance
- Patent number 11,869,933
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Raja Selvaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging extendable lead and method therefor
- Patent number 11,869,837
- Issue date Jan 9, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method, and electronic appli...
- Patent number 11,862,656
- Issue date Jan 2, 2024
- Sony Group Corporation
- Jun Ogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device having back side illuminated imag...
- Patent number 11,735,619
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching power supply module and packaging method thereof
- Patent number 11,657,947
- Issue date May 23, 2023
- Shenzhen Sunlord Electronics Co., Ltd.
- Wenjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 11,621,678
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including step of sim...
- Patent number 11,574,944
- Issue date Feb 7, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Motomu Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 11,508,773
- Issue date Nov 22, 2022
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,502,063
- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device, image pickup system and method of...
- Patent number 11,437,421
- Issue date Sep 6, 2022
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus, manufacturing method of the same, an...
- Patent number 11,438,540
- Issue date Sep 6, 2022
- Sony Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20240312862
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240258215
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mei Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20240120322
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
- Publication number 20240105579
- Publication date Mar 28, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240090239
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Kiichi TACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) AND ELECTRONIC APPARATUS
- Publication number 20230075399
- Publication date Mar 9, 2023
- Nuvoton Technology Corporation
- Uri TRICHTER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230055685
- Publication date Feb 23, 2023
- SONY GROUP CORPORATION
- Shinji MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR
- Publication number 20230027248
- Publication date Jan 26, 2023
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20230025045
- Publication date Jan 26, 2023
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20220415821
- Publication date Dec 29, 2022
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...
- Publication number 20220375981
- Publication date Nov 24, 2022
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...
- Publication number 20220345653
- Publication date Oct 27, 2022
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD
- Publication number 20220328453
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20220302195
- Publication date Sep 22, 2022
- Sony Semiconductor Solutions Corporation
- HIDEKI MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Image Sensor Device Having Back Side Illuminated Imag...
- Publication number 20220302187
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...
- Publication number 20220254824
- Publication date Aug 11, 2022
- Sony Semiconductor Solutions Corporation
- MITSUHITO KANATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPLI...
- Publication number 20220231070
- Publication date Jul 21, 2022
- SONY GROUP CORPORATION
- Jun OGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20220173092
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093544
- Publication date Mar 24, 2022
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding For Semiconductor Devices
- Publication number 20220052014
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ISOLATOR WITH REDUCED PARASITIC CAPACITANCE
- Publication number 20210367030
- Publication date Nov 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Raja Selvaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELEC...
- Publication number 20210183916
- Publication date Jun 17, 2021
- Sony Semiconductor Solutions Corporation
- Yukihiro ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20210118762
- Publication date Apr 22, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS

the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Extendable inner lead for leaded package

Palladium-coated copper bonding wire and method for manufacturing same

Chip package, method of forming a chip package and method of formin...

Hybrid bonding with uniform pattern density

Thermal routing trench by additive processing

Solid-state imaging apparatus, manufacturing method of the same, an...

Semiconductor package including a dummy pad

Stacked integrated circuits with redistribution lines

Wire bonding for semiconductor devices

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device including bond pad with fixing parts fixed ont...

Device isolator with reduced parasitic capacitance

Semiconductor device packaging extendable lead and method therefor

Semiconductor device and manufacturing method, and electronic appli...

Semiconductor device and method of manufacturing the same

Semiconductor device packages with high angle wire bonding and non-...

Semiconductor image sensor device having back side illuminated imag...

Switching power supply module and packaging method thereof

Semiconductor device and power amplifier module

Redistribution layer (RDL) structure, semiconductor device and manu...

Method for manufacturing semiconductor device including step of sim...

Image pickup device and electronic apparatus

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device and method of manufacturing the same

Photoelectric conversion device, image pickup system and method of...

Solid-state imaging apparatus, manufacturing method of the same, an...

Method of forming an aluminum oxide layer, metal surface with alumi...

Bonding pad layer system, gas sensor and method for manufacturing a...

Semiconductor apparatus

Patents Applicationslast 30 patents

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

EXTENDABLE INNER LEAD FOR LEADED PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

INTEGRATED CIRCUIT (IC) AND ELECTRONIC APPARATUS

IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...

SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD OF THE SAME, AN...

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD

SOLID-STATE IMAGING DEVICE

Semiconductor Image Sensor Device Having Back Side Illuminated Imag...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPLI...

Hybrid Bonding with Uniform Pattern Density

SEMICONDUCTOR DEVICE

Wire Bonding For Semiconductor Devices

DEVICE ISOLATOR WITH REDUCED PARASITIC CAPACITANCE

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELEC...

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING