the connecting portions being stacked

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H01L2224/2541

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2541the connecting portions being stacked

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,158,578
- Issue date Oct 26, 2021
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 10,446,499
- Issue date Oct 15, 2019
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for stacked semiconductor memory devices
- Patent number 9,472,243
- Issue date Oct 18, 2016
- Apple Inc.
- Anthony Fai
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems and methods for stacked semiconductor memory devices
- Patent number 8,780,600
- Issue date Jul 15, 2014
- Apple Inc.
- Anthony Fai
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-on-wafer Cascode HEMT Device
- Publication number 20230343693
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haw-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT
- Publication number 20230083493
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Seungwan SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS
- Publication number 20230065075
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING TECHNIQUES FOR STACKED CMOS DEVICES
- Publication number 20150162295
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20150035144
- Publication date Feb 5, 2015
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Stacked Semiconductor Memory Devices
- Publication number 20140321189
- Publication date Oct 30, 2014
- Anthony Fai
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20140175636
- Publication date Jun 26, 2014
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR STACKED SEMICONDUCTOR MEMORY DEVICES
- Publication number 20130148401
- Publication date Jun 13, 2013
- Apple Inc.
- Anthony Fai
- G11 - INFORMATION STORAGE

the connecting portions being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnect device and method

Wafer chip scale packages with visible solder fillets

High density interconnect device and method

High density interconnect device and method

Stacked electronics package and method of manufacturing thereof

High density interconnect device and method

Systems and methods for stacked semiconductor memory devices

Systems and methods for stacked semiconductor memory devices

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

Wafer-on-wafer Cascode HEMT Device

SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT

WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

CONNECTING TECHNIQUES FOR STACKED CMOS DEVICES

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

Systems and Methods for Stacked Semiconductor Memory Devices

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SYSTEMS AND METHODS FOR STACKED SEMICONDUCTOR MEMORY DEVICES