the connection portion being formed on the die mounting surface of the substrate

Industry

CPC
H01L2924/1532

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1532the connection portion being formed on the die mounting surface of the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated self-aligned assembly
- Patent number 12,119,307
- Issue date Oct 15, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electronic components to substrates
- Patent number 12,094,811
- Issue date Sep 17, 2024
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 12,087,652
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch BVA using reconstituted wafer with area array accessible...
- Patent number 11,990,382
- Issue date May 21, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die memory device
- Patent number 11,990,177
- Issue date May 21, 2024
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head and printer
- Patent number 11,897,261
- Issue date Feb 13, 2024
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided partial molded SIP module
- Patent number 11,887,863
- Issue date Jan 30, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for thermal fatigue resistance and interconnect joint re...
- Patent number 11,848,292
- Issue date Dec 19, 2023
- Intel Corporation
- Sireesha Gogineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,791,252
- Issue date Oct 17, 2023
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 11,764,158
- Issue date Sep 19, 2023
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit I/O integrity and degradation monitoring
- Patent number 11,762,789
- Issue date Sep 19, 2023
- PROTEANTECS LTD.
- Eyal Fayneh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package with fan-out structures
- Patent number 11,764,159
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,721,672
- Issue date Aug 8, 2023
- Kioxia Corporation
- Yuichi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,721,882
- Issue date Aug 8, 2023
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assortment of substrates for semiconductor circuits, corresponding...
- Patent number 11,705,388
- Issue date Jul 18, 2023
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer frame and method of manufacturing the same
- Patent number 11,699,691
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,682,653
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-die memory device
- Patent number 11,657,868
- Issue date May 23, 2023
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...
- Publication number 20240347404
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266321
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
- Publication number 20240213156
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Partial Molded SiP Module
- Publication number 20240153783
- Publication date May 9, 2024
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
- Publication number 20240105680
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALLER MODULE BY STACKING
- Publication number 20240038743
- Publication date Feb 1, 2024
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20240030117
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PAD FAILURE DETECTION
- Publication number 20240004812
- Publication date Jan 4, 2024
- PROTEANTECS LTD.
- Eyal FAYNEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SUBSTRATE PACKAGE AND LEAD FRAME
- Publication number 20230411251
- Publication date Dec 21, 2023
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
- Publication number 20230378078
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230335533
- Publication date Oct 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230290761
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230269868
- Publication date Aug 24, 2023
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230245902
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230154904
- Publication date May 18, 2023
- DENSO CORPORATION
- Hiroyoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Partial Molded SIP Module
- Publication number 20230074430
- Publication date Mar 9, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
- Publication number 20230075555
- Publication date Mar 9, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch BVA Using Reconstituted Wafer With Area Array Accessible...
- Publication number 20230005804
- Publication date Jan 5, 2023
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384289
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220310571
- Publication date Sep 29, 2022
- DENSO CORPORATION
- Hiroyoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS

the connection portion being formed on the die mounting surface of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated self-aligned assembly

Offset interposers for large-bottom packages and large-die package-...

Connecting electronic components to substrates

Semiconductor package device and method of manufacturing the same

Package-on-package semiconductor assemblies and methods of manufact...

Fine pitch BVA using reconstituted wafer with area array accessible...

Multi-die memory device

Offset interposers for large-bottom packages and large-die package-...

Devices and methods related to dual-sided radio-frequency package w...

Stack package and methods of manufacturing the same

Printed heat spreader structures and methods of providing same

Semiconductor device and manufacturing method thereof

Head and printer

Double-sided partial molded SIP module

Semiconductor device with sealed semiconductor chip

Pad design for thermal fatigue resistance and interconnect joint re...

Offset interposers for large-bottom packages and large-die package-...

Package-on-package semiconductor assemblies and methods of manufact...

Embedded multi-die interconnect bridge packages with lithographical...

Integrated circuit I/O integrity and degradation monitoring

Package with fan-out structures

Patch on interposer package with wireless communication interface

Semiconductor device and manufacturing method thereof

Semiconductor package having discrete antenna device

Assortment of substrates for semiconductor circuits, corresponding...

Interposer frame and method of manufacturing the same

Semiconductor device and method of forming interposer with opening...

IC chip package with dummy solder structure under corner, and relat...

Semiconductor device package and method for manufacturing the same

Multi-die memory device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

Lead-Free Solder Ball

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

Double-Sided Partial Molded SiP Module

SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...

SMALLER MODULE BY STACKING

MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT PAD FAILURE DETECTION

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

THIN SUBSTRATE PACKAGE AND LEAD FRAME

PACKAGE WITH FAN-OUT STRUCTURES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

Double-Sided Partial Molded SIP Module

ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES

Fine Pitch BVA Using Reconstituted Wafer With Area Array Accessible...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

ELECTRONIC DEVICE