the connector being orthogonal to a side surface of the semiconductor or solid-state body

Industry

CPC
H01L2224/48106

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48106the connector being orthogonal to a side surface of the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,051,636
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centralized placement of command and address swapping in memory dev...
- Patent number 11,961,585
- Issue date Apr 16, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,411
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die over mold stacked semiconductor package
- Patent number 11,948,917
- Issue date Apr 2, 2024
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor package with continuous insulation
- Patent number 11,895,930
- Issue date Feb 6, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowires plated on nanoparticles
- Patent number 11,869,864
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
- Publication date Sep 5, 2024
- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240296980
- Publication date Sep 5, 2024
- ROHM CO., LTD.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGING STRUCTURE
- Publication number 20240282727
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chung-Hsiao Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20240275373
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240268025
- Publication date Aug 8, 2024
- Yunnan Invensight Optoelectronics Technology Co., Ltd.
- Xiao BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234402
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240213165
- Publication date Jun 27, 2024
- PowerX Semiconductor Corporation
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240203929
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240203863
- Publication date Jun 20, 2024
- ROBERT BOSCH GmbH
- Gunnar BRUNS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP
- Publication number 20240186310
- Publication date Jun 6, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP
- Publication number 20240186309
- Publication date Jun 6, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240178212
- Publication date May 30, 2024
- KIOXIA Corporation
- Ken MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240179925
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jaekyu SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20240178006
- Publication date May 30, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS

the connector being orthogonal to a side surface of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Through electrode substrate and semiconductor device

Semiconductor packages

Sensor package structure

Offset interposers for large-bottom packages and large-die package-...

Command and address interface regions, and associated devices and s...

QFN device having a mechanism that enables an inspectable solder jo...

Spring bar leadframe, method and packaged electronic device with ze...

Switching device and electronic circuit

Switching device and electronic circuit

Face-to-face semiconductor device with fan-out porch

Power module

Power module and fabrication method of the same, graphite plate, an...

Light-emitting substrate, method of manufacturing light-emitting su...

Chip package, method of forming a chip package and method of formin...

Offset interposers for large-bottom packages and large-die package-...

Integrated high voltage capacitor

Centralized placement of command and address swapping in memory dev...

Devices and methods related to dual-sided radio-frequency package w...

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor device

Semiconductor package including a dummy pad

Die over mold stacked semiconductor package

Switching device and electronic circuit

Methods of manufacturing an integrated circuit having stress tuning...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor package with solder standoff

Current sensor package with continuous insulation

Nanowires plated on nanoparticles

Semiconductor device and manufacturing method of the same

Patents Applicationslast 30 patents

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

SEMICONDUCTOR DEVICE

Semiconductor Device Package with Die Stackup and Interposer

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

SEMICONDUCTOR DEVICE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

POWER CHIP PACKAGING STRUCTURE

PASSIVE ELEMENT AND ELECTRONIC DEVICE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

POWER MODULE

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

SEMICONDUCTOR MODULE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

POWER MODULE

SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP

SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

SEMICONDUCTOR DEVICE