the connector being supplied to the parts to be connected in the bonding apparatus

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H01L2224/861

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/861the connector being supplied to the parts to be connected in the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for transferring semiconductor devices from a...
- Patent number 11,183,478
- Issue date Nov 23, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transfering semiconductor devices from a s...
- Patent number 10,529,685
- Issue date Jan 7, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of ultrathin functional block by solid ph...
- Patent number 10,522,510
- Issue date Dec 31, 2019
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20200135688
- Publication date Apr 30, 2020
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20180226376
- Publication date Aug 9, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...
- Publication number 20180151541
- Publication date May 31, 2018
- Intel Corporation
- Kimin JUN
- H01 - BASIC ELECTRIC ELEMENTS