the connector not being orthogonal to a side surface of the semiconductor or solid-state body

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H01L2224/48108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48108the connector not being orthogonal to a side surface of the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 12,051,636
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 11,417,812
- Issue date Aug 16, 2022
- Rohm Co., Ltd.
- Dai Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,393,795
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multiple-path power amplifier
- Patent number 11,018,629
- Issue date May 25, 2021
- NXP USA, INC.
- Seungkee Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 10,971,486
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Hee-Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive chip package including shielding structure
- Patent number 10,923,650
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Jae-gwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pin routing thru lead frame etching
- Patent number 10,872,785
- Issue date Dec 22, 2020
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device provided with same
- Patent number 10,825,760
- Issue date Nov 3, 2020
- SOCIONEXT INC.
- Toshihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-to-board contactless connectors and methods for the assembly...
- Patent number 10,772,192
- Issue date Sep 8, 2020
- KEYSSA SYSTEMS, INC.
- Roger D. Isaac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,600,830
- Issue date Mar 24, 2020
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging power semiconductor module including power tran...
- Patent number 10,566,258
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillator, electronic apparatus, and vehicle
- Patent number 10,511,259
- Issue date Dec 17, 2019
- Seiko Epson Corporation
- Naohisa Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus having bond wires
- Patent number 10,490,524
- Issue date Nov 26, 2019
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Ivan Ndip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit connection arrangement for minimizing crosstalk
- Patent number 10,446,687
- Issue date Oct 15, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced node cost reduction by ESD interposer
- Patent number 10,446,541
- Issue date Oct 15, 2019
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric conductor track, method, and use
- Patent number 10,438,871
- Issue date Oct 8, 2019
- Continental Teves AG & Co. oHG
- Svenja Raukopf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe and integrated circuit connection arrangement
- Patent number 10,424,666
- Issue date Sep 24, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus with a data driving chip and a gate driving chip...
- Patent number 10,424,558
- Issue date Sep 24, 2019
- Samsung Display Co., Ltd.
- Sang-Chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 10,381,334
- Issue date Aug 13, 2019
- Samsung Electronics Co., Ltd.
- Hee-Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pin routing thru lead frame etching
- Patent number 10,361,098
- Issue date Jul 23, 2019
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 10,325,877
- Issue date Jun 18, 2019
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 10,297,582
- Issue date May 21, 2019
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312950
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takaya HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312875
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Rie ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240268025
- Publication date Aug 8, 2024
- Yunnan Invensight Optoelectronics Technology Co., Ltd.
- Xiao BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234402
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS
- Publication number 20240186346
- Publication date Jun 6, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170373
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136347
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071875
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Hiroyuki TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369185
- Publication date Nov 16, 2023
- Rohm Co., Ltd.
- Yuto NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20230317567
- Publication date Oct 5, 2023
- Li-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230268311
- Publication date Aug 24, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
- Publication number 20230197668
- Publication date Jun 22, 2023
- Mitsubishi Electric Corporation
- Yoshiko TAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...
- Publication number 20230046645
- Publication date Feb 16, 2023
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384373
- Publication date Dec 1, 2022
- XINTEC INC.
- Chieh CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367417
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongjin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE PROVIDING ISOLATED FILTER ON LEAD-FRAME
- Publication number 20220093581
- Publication date Mar 24, 2022
- BeRex Inc.
- Lothar Johannes Maria Musiol
- H01 - BASIC ELECTRIC ELEMENTS

the connector not being orthogonal to a side surface of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module

Semiconductor device

Semiconductor package

Straight wirebonding of silicon dies

Semiconductor light emitting device

Semiconductor package

Bond pad structure for bonding improvement

Method of manufacturing semiconductor module and semiconductor module

Integrated multiple-path power amplifier

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device having terminals directly attachable to circui...

Magneto-resistive chip package including shielding structure

QFN pin routing thru lead frame etching

Semiconductor chip and semiconductor device provided with same

Board-to-board contactless connectors and methods for the assembly...

Bond pad structure for bonding improvement

Sensor package structure

Method of packaging power semiconductor module including power tran...

Oscillator, electronic apparatus, and vehicle

Antenna apparatus having bond wires

Integrated circuit connection arrangement for minimizing crosstalk

Advanced node cost reduction by ESD interposer

Electric conductor track, method, and use

Leadframe and integrated circuit connection arrangement

Display apparatus with a data driving chip and a gate driving chip...

Semiconductor package and method of manufacturing the semiconductor...

QFN pin routing thru lead frame etching

Embedded wire bond wires for vertical integration with separate sur...

Light emitting device and light emitting module

BVA interposer

Patents Applicationslast 30 patents

DIE ISOLATION WITH CONFORMAL COATING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

Semiconductor Device and Method for Sensing External Condition in H...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LEADFRAME

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...

INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

IC PACKAGE PROVIDING ISOLATED FILTER ON LEAD-FRAME