the connector not being orthogonal to a side surface of the semiconductor or solid-state body

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H01L2224/40108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40108the connector not being orthogonal to a side surface of the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a clip
- Patent number 10,424,534
- Issue date Sep 24, 2019
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor package with three-terminal clip
- Patent number 10,290,567
- Issue date May 14, 2019
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out PoP stacking process
- Patent number 9,379,097
- Issue date Jun 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient integrated circuit package
- Patent number 8,716,830
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230268311
- Publication date Aug 24, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor package with three-terminal clip
- Publication number 20190074243
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Rainald SANDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CLIP
- Publication number 20170250125
- Publication date Aug 31, 2017
- INFINEON TECHNOLOGIES AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE
- Publication number 20130127008
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS