the connectors being bonded to at least one common bonding area

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H01L2224/2511

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2511the connectors being bonded to at least one common bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with three-dimensional conductive planes, and m...
- Patent number 10,418,344
- Issue date Sep 17, 2019
- Micross Advanced Interconnect Technology LLC
- Erik Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-on-wafer Cascode HEMT Device
- Publication number 20230343693
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haw-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS