the connectors being bonded to at least one common bonding area

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CPC
H01L2224/4111

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4111the connectors being bonded to at least one common bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 11,469,205
- Issue date Oct 11, 2022
- Adventive International Ltd.
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 10,615,146
- Issue date Apr 7, 2020
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for a semiconductor component
- Patent number 10,347,590
- Issue date Jul 9, 2019
- Conti Temic microelectronic GmbH
- Olivier Pola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,199,347
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 9,905,500
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Universal Surface-Mount Semiconductor Package
- Publication number 20220415849
- Publication date Dec 29, 2022
- Adventive International Ltd.
- Richard K Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal Surface-Mount Semiconductor Package
- Publication number 20200273838
- Publication date Aug 27, 2020
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20170025336
- Publication date Jan 26, 2017
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR...
- Publication number 20120112308
- Publication date May 10, 2012
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

the connectors being bonded to at least one common bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Universal surface-mount semiconductor package

Die stack assembly using an edge separation structure for connectiv...

Die stack assembly using an edge separation structure for connectiv...

Universal surface-mount semiconductor package

Semiconductor module and conductive member for semiconductor module...

Leadframe for a semiconductor component

Semiconductor device

Semiconductor component and method of manufacture

Patents Applicationslast 30 patents

Universal Surface-Mount Semiconductor Package

Universal Surface-Mount Semiconductor Package

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR...