the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body

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H01L2224/41112

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/41112the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body

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Patents Grantslast 30 patents

Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 9,905,500
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20170025336
- Publication date Jan 26, 2017
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS