the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body

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H01L2224/49112

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49112the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,894,349
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,863,166
- Issue date Jan 2, 2024
- Mitsubishi Electric Corporation
- Junichi Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,791,303
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,677,312
- Issue date Jun 13, 2023
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,658,149
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of integrated circuits
- Patent number 11,640,946
- Issue date May 2, 2023
- STMicroelectronics (Grenoble 2) SAS
- Denis Farison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,605,577
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor dies of differing size...
- Patent number 11,552,050
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Ahmad Zarif Bin Azahar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi wire bonding with current sensing method
- Patent number 11,519,943
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,515,292
- Issue date Nov 29, 2022
- Fuji Electric Co., Ltd.
- Mitsuhiro Kakefu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,502,063
- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 11,417,812
- Issue date Aug 16, 2022
- Rohm Co., Ltd.
- Dai Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages and methods for maximizing electrical cu...
- Patent number 11,373,974
- Issue date Jun 28, 2022
- Intel Corporation
- Bilal Khalaf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch module
- Patent number 11,264,353
- Issue date Mar 1, 2022
- Murata Manufacturing Co., Ltd.
- Kenta Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,217,510
- Issue date Jan 4, 2022
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of integrated circuits
- Patent number 11,139,255
- Issue date Oct 5, 2021
- STMicroelectronics (Rousset) SAS
- Denis Farison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 11,094,670
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with bond pad extensions formed on molded appe...
- Patent number 11,081,455
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,037,910
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282660
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258186
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20240120322
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
- Publication number 20240112993
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...
- Publication number 20240038295
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Youngdo Um
- G11 - INFORMATION STORAGE
Information Patent Application
RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVE...
- Publication number 20230420405
- Publication date Dec 28, 2023
- Lumentum Operations LLC
- Flavio DELL'ORTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230411357
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Jun TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230378038
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING...
- Publication number 20230369410
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Elias Pree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369185
- Publication date Nov 16, 2023
- Rohm Co., Ltd.
- Yuto NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...
- Publication number 20230282559
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF INTEGRATED CIRCUITS
- Publication number 20230245984
- Publication date Aug 3, 2023
- STMicroelectronics (Grenoble 2) SAS
- Denis FARISON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION DEVICE
- Publication number 20230223750
- Publication date Jul 13, 2023
- NEXPERIA B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND CHIP THEREOF
- Publication number 20230139424
- Publication date May 4, 2023
- Realtek Semiconductor Corp.
- CHIA-LIN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230087607
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20230025045
- Publication date Jan 26, 2023
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220406746
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...
- Publication number 20220392866
- Publication date Dec 8, 2022
- SK HYNIX INC.
- Jeong Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZE...
- Publication number 20220230992
- Publication date Jul 21, 2022
- Western Digital Technologies, Inc.
- Ahmad Zarif Bin Azahar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189914
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jin Kyoung PARK
- H01 - BASIC ELECTRIC ELEMENTS

the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including stacked semiconductor chips

Semiconductor device

Semiconductor device having laterally offset stacked semiconductor...

Semiconductor device including a bidirectional switch

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor device comprising PN junction diode and Schottky barr...

Power semiconductor module and power converter

Semiconductor devices with package-level configurability

Semiconductor package including semiconductor chips

Semiconductor device and power converter

Semiconductor package including stacked semiconductor chips

Semiconductor package including stacked semiconductor chips

Protection of integrated circuits

Semiconductor device including a bidirectional switch

Semiconductor package including semiconductor chips

Semiconductor device including semiconductor dies of differing size...

Multi wire bonding with current sensing method

Semiconductor device

Semiconductor device comprising PN junction diode and Schottky barr...

Grounding techniques for backside-biased semiconductor dice and rel...

Semiconductor light emitting device

Electronic device packages and methods for maximizing electrical cu...

Switch module

Semiconductor device including a bidirectional switch

Protection of integrated circuits

Semiconductor device assemblies including multiple shingled stacks...

Semiconductor device with bond pad extensions formed on molded appe...

Semiconductor device having laterally offset stacked semiconductor...

Method of manufacturing semiconductor module and semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PASSIVE ELEMENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...

SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...

RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVE...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS

TRANSISTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING...

SEMICONDUCTOR DEVICE

MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

PROTECTION OF INTEGRATED CIRCUITS

ESD PROTECTION DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

ELECTRONIC PACKAGE STRUCTURE AND CHIP THEREOF

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZE...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS