TREA

the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body

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Industry

  • CPC
  • H01L2224/41113
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/41113the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Leadframe for a semiconductor component
    • Patent number 10,347,590
    • Issue date Jul 9, 2019
    • Conti Temic microelectronic GmbH
    • Olivier Pola
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,199,347
    • Issue date Feb 5, 2019
    • Fuji Electric Co., Ltd.
    • Tomohiro Nishimura
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents