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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/072the devices being arranged next to each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,159,810
- Issue date Dec 3, 2024
- Denso Corporation
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,737
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuto Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
- Patent number 12,148,631
- Issue date Nov 19, 2024
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die packages including a contiguous heat spreader
- Patent number 12,136,577
- Issue date Nov 5, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 12,131,988
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,125,829
- Issue date Oct 22, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with cooling fins in a matrix form
- Patent number 12,127,382
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Yoshihiro Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead adapters for semiconductor package
- Patent number 12,113,000
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a pressure device acting on a swi...
- Patent number 12,112,994
- Issue date Oct 8, 2024
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Stefan Oehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,113,009
- Issue date Oct 8, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of bus bars intersecting a plurality electrode
- Patent number 12,113,010
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Shigeto Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for operating an electric vehicle drive with improved...
- Patent number 12,107,027
- Issue date Oct 1, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,108,563
- Issue date Oct 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor module, vehicle, and manufactur...
- Patent number 12,107,030
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Sho Takano
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 12,100,664
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,638
- Issue date Sep 24, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic arrangement with DC voltage connection element and...
- Patent number 12,095,212
- Issue date Sep 17, 2024
- Semikron Elektronik GmbH & Co. KG
- Jürgen Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having an elevated power plane with an integrated sign...
- Patent number 12,087,680
- Issue date Sep 10, 2024
- Wolfspeed, Inc.
- Zach Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor module
- Patent number 12,087,740
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,087,651
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Kazuma Noda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240420968
- Publication date Dec 19, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Schmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421132
- Publication date Dec 19, 2024
- DENSO CORPORATION
- Shingo TSUCHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240421097
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Kenshirou ICHIYASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Module
- Publication number 20240413127
- Publication date Dec 12, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413090
- Publication date Dec 12, 2024
- Sumitomo Electric Industries, Ltd.
- Toru HIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES
- Publication number 20240404903
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Anita Herzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395777
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Tetsuo YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
- Publication number 20240395662
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ingoo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...
- Publication number 20240395565
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395691
- Publication date Nov 28, 2024
- Fuji Electric Co., Ltd.
- Yuta EBUKURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240395786
- Publication date Nov 28, 2024
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240387473
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Tomoya KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387318
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Ryota KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
- Publication number 20240387443
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379485
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240379737
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Ryosuke ISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR DEVICE
- Publication number 20240379499
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...
- Publication number 20240371783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and temperature measurement method

Systems and methods for phase switch timing controller for inverter...

Semiconductor device

Semiconductor device

Housing, semiconductor module and methods for producing the same

Semiconductor module, method for manufacturing semiconductor module...

Semiconductor device

Integrated circuit die packages including a contiguous heat spreader

Semiconductor package and passive element with interposer

Systems and methods for bidirectional message architecture for inve...

Method of forming a semiconductor package with connection lug

Electronic device

Semiconductor module with cooling fins in a matrix form

Method of manufacturing semiconductor structure

Lead adapters for semiconductor package

Power semiconductor module having a pressure device acting on a swi...

Semiconductor device

Plurality of transistors attached to a heat sink with a periphery n...

Plurality of bus bars intersecting a plurality electrode

Power module for operating an electric vehicle drive with improved...

Systems and methods for integrated gate driver for inverter for ele...

Power electronics assemblies having embedded power electronics devices

Semiconductor device, semiconductor module, vehicle, and manufactur...

Semiconductor device with curved conductive lines and method of for...

Semiconductor device

Semiconductor device

Power electronic arrangement with DC voltage connection element and...

Power module having an elevated power plane with an integrated sign...

Method of forming a semiconductor module

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR DEVICE

Semiconductor Package

SEMICONDUCTOR MODULE

Method of Forming a Semiconductor Module

SEMICONDUCTOR DEVICE

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SEMICONDUCTOR DEVICE

METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...

EMITTERS FOR INTEGRATED POWER CARD COOLING

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE

HIGH SPEED, EFFICIENT SIC POWER MODULE

SEMICONDUCTOR DEVICE

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

COOLER AND SEMICONDUCTOR DEVICE

POWER MODULE WITH BALANCED CURRENT FLOW

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...