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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/072the devices being arranged next to each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Structures for providing electrical isolation in semiconductor devices
- Patent number 12,368,139
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,292
- Issue date Jul 15, 2025
- Mitsubishi Electric Corporation
- Daisuke Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,362,331
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a substrate arrangement, having p...
- Patent number 12,362,312
- Issue date Jul 15, 2025
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,264
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module with transistor dies for multiple amplifier...
- Patent number 12,347,740
- Issue date Jul 1, 2025
- NXP USA, INC.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semifinished product for populating with components and, method for...
- Patent number 12,341,127
- Issue date Jun 24, 2025
- Siemens Aktiengesellschaft
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 12,334,466
- Issue date Jun 17, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,334,427
- Issue date Jun 17, 2025
- Mitsubishi Electric Corporation
- Masaomi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 12,327,771
- Issue date Jun 10, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,308,349
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Takamasa Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device having a photonic crystal structure
- Patent number 12,310,150
- Issue date May 20, 2025
- Osram Opto Semiconductors GmbH
- Ali Mahdavi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,308,350
- Issue date May 20, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...
- Publication number 20250239535
- Publication date Jul 24, 2025
- IBIDEN CO., LTD.
- Yuichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20250239556
- Publication date Jul 24, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20250240006
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250233116
- Publication date Jul 17, 2025
- DIODES INCORPORATED
- Shu-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233056
- Publication date Jul 17, 2025
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20250233045
- Publication date Jul 17, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250226294
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250219043
- Publication date Jul 3, 2025
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, MANUFACTURING METHOD THEREOF AND ELECTRICAL SYSTEM
- Publication number 20250218954
- Publication date Jul 3, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Nan Nan ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
HIGH PERFORMANCE EMBEDDED 1T1C MEMORY CELLS
- Publication number 20250220884
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210503
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250210569
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Takumi Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FOOTPRINT POWER SWITCH
- Publication number 20250212333
- Publication date Jun 26, 2025
- VISIC TECHNOLOGIES LTD
- Guillermo Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210532
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210504
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210424
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210443
- Publication date Jun 26, 2025
- Mitsubishi Electric Corporation
- Yasuhiro SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210475
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250212480
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Yoshiki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250210534
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Yoichi NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250201724
- Publication date Jun 19, 2025
- ZF Friedrichshafen AG
- Shaozhi Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250202339
- Publication date Jun 19, 2025
- Mitsubishi Electric Corporation
- Ikumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE DISSIPATION OF HEAT FROM INTEGRATE...
- Publication number 20250201661
- Publication date Jun 19, 2025
- Intel Corporation
- Joachim Stahl
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250201679
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Mitsuki KAWANO
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for power module for inverter for electric vehicle

Structures for providing electrical isolation in semiconductor devices

Semiconductor device

Semiconductor device and manufacturing method thereof

Power semiconductor module having a substrate arrangement, having p...

Semiconductor device

Semiconductor module with external power sensor

Semiconductor package and related methods

Semiconductor package and semiconductor device

Power amplifier module with transistor dies for multiple amplifier...

Systems and methods for power module for inverter for electric vehicle

Semiconductor device stack-up with bulk substrate material to mitig...

Semiconductor device comprising PN junction diode and Schottky barr...

Semifinished product for populating with components and, method for...

Systems and methods for multiple output integrated gate driver for...

Semiconductor module

Semiconductor device

Systems and methods for galvanic isolation for inverter for electri...

Semiconductor module

Power module semiconductor device and inverter equipment, and fabri...

Baffles for electronic circuits immersed in cooling fluid in a tank

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Switching device and electronic circuit

Power module package for direct cooling multiple power modules

Semiconductor apparatus

Optoelectronic device having a photonic crystal structure

Semiconductor package system and related methods

Semiconductor device

Patents Applicationslast 30 patents

ULTRA-THIN PACKAGED COMPONENT

COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...

PACKAGE DEVICE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE

Electronic Device and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

PACKAGE, MANUFACTURING METHOD THEREOF AND ELECTRICAL SYSTEM

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

HIGH PERFORMANCE EMBEDDED 1T1C MEMORY CELLS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SMALL FOOTPRINT POWER SWITCH

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR DEVICE

METHODS AND APPARATUS TO IMPROVE DISSIPATION OF HEAT FROM INTEGRATE...

SEMICONDUCTOR DEVICE