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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/072the devices being arranged next to each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,678
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-level power module
- Patent number 12,261,543
- Issue date Mar 25, 2025
- Danfoss Silicon Power GmbH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,243,799
- Issue date Mar 4, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving current balance of parallel chips in power modu...
- Patent number 12,243,814
- Issue date Mar 4, 2025
- Hyundai Mobis Co., Ltd.
- Yu Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power module
- Patent number 12,199,071
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a curved part in the printed circuit board
- Patent number 12,191,245
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED packaging structure
- Patent number 12,176,473
- Issue date Dec 24, 2024
- Peng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250118629
- Publication date Apr 10, 2025
- ROHM CO., LTD.
- Tomohiro YASUNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118621
- Publication date Apr 10, 2025
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118623
- Publication date Apr 10, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER MODULE
- Publication number 20250112211
- Publication date Apr 3, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Manufacturing Semiconductor Pa...
- Publication number 20250112109
- Publication date Apr 3, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko Bernardoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING
- Publication number 20250105164
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jooyang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20250105110
- Publication date Mar 27, 2025
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105069
- Publication date Mar 27, 2025
- Fuji Electric Co., Ltd.
- Eri KAMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE CONFIGURED FOR THERMAL MANAGEMENT
- Publication number 20250105083
- Publication date Mar 27, 2025
- Analog Power Conversion LLC
- Amaury Gendron-Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-LEVEL POWER SEMICONDUCTOR MODULE AND ARRANGEMENT THEREWITH
- Publication number 20250105758
- Publication date Mar 27, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Peter BECKEDAHL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Inverter Provided With Semiconductor Device
- Publication number 20250096079
- Publication date Mar 20, 2025
- Hitachi Astemo, Ltd.
- Masahiro SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096086
- Publication date Mar 20, 2025
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20250096159
- Publication date Mar 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096068
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and a Method for Forming a Semiconductor Device
- Publication number 20250087643
- Publication date Mar 13, 2025
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER ELECTRONICS MODULE AND ASSEMBLY METHOD
- Publication number 20250079407
- Publication date Mar 6, 2025
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079280
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- WEI-CHUNG CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-CORROSION PARTICLES IN SEMICONDUCTOR DEVICE
- Publication number 20250069970
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Isabelle Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069967
- Publication date Feb 27, 2025
- DENSO CORPORATION
- Akinori SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250062272
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20250062290
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250062271
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Half-bridge switch arrangement
- Publication number 20250055384
- Publication date Feb 13, 2025
- SEG Automotive Germany GmbH
- Nima SAADAT
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Three-level power module

Systems and methods for cooling system and power module for inverte...

Embedded package with electrically isolating dielectric liner

Electronic packages with integral heat spreaders

Method of improving current balance of parallel chips in power modu...

Semiconductor device having through parts of different shapes

Semiconductor package and related methods

Systems and methods for low inductance phase switch for inverter fo...

Semiconductor module and power conversion apparatus

Systems and methods for adaptive gate driver for inverter for elect...

Electronic device

Semiconductor device with improved performance in operation and imp...

Systems and methods for integrated gate driver for inverter for ele...

Power semiconductor package having first and second lead frames

Method of processing a semiconductor wafer, semiconductor die, and...

Packaging structure of power semiconductor module

Submodule semiconductor package

Systems and methods for non-overlap enforcement for inverter for el...

Electronic packages with integral heat spreaders

Semiconductor module

Compact power module

Semiconductor device including surface pressure absorbing member fo...

Semiconductor device having a curved part in the printed circuit board

Thermal performance improvement and stress reduction in semiconduct...

Method of producing a multi-chip assembly

Systems and methods for single channel fault encoding for inverter...

Half-bridge module for an inverter of an electric drive of an elect...

LED packaging structure

Semiconductor device and temperature measurement method

Patents Applicationslast 30 patents

COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

POWER MODULE AND MANUFACTURING METHOD THEREFOR

COMPACT POWER MODULE

Semiconductor Package and Method for Manufacturing Semiconductor Pa...

LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE CONFIGURED FOR THERMAL MANAGEMENT

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

THREE-LEVEL POWER SEMICONDUCTOR MODULE AND ARRANGEMENT THEREWITH

Semiconductor Device and Inverter Provided With Semiconductor Device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

SEMICONDUCTOR DEVICE

Semiconductor Device and a Method for Forming a Semiconductor Device

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

POWER ELECTRONICS MODULE AND ASSEMBLY METHOD

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTI-CORROSION PARTICLES IN SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

Half-bridge switch arrangement