the devices being connected to a common substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/97the devices being connected to a common substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 12,272,672
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 12,274,104
- Issue date Apr 8, 2025
- Nichia Corporation
- Takuya Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly apparatus
- Patent number 12,272,760
- Issue date Apr 8, 2025
- LG Electronics Inc.
- Junghun Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package assembly
- Patent number 12,266,631
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode display panel with micro lens array
- Patent number 12,261,162
- Issue date Mar 25, 2025
- Jade Bird Display (Shanghai) Limited
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mosaic focal plane array
- Patent number 12,261,186
- Issue date Mar 25, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,237,245
- Issue date Feb 25, 2025
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly encapsulating light emitting diodes
- Patent number 12,230,743
- Issue date Feb 18, 2025
- ehux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package
- Patent number 12,217,976
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, resin package, resin-molded body, and method...
- Patent number 12,211,959
- Issue date Jan 28, 2025
- Nichia Corporation
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Multi-dimensional integrated circuits having semiconductors mounted...
- Patent number 12,199,196
- Issue date Jan 14, 2025
- GBT Tokenize Corp.
- Danny Rittman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,191,251
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118616
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Tea-Geon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Inhibiting Creep of Underfill Ma...
- Publication number 20250118643
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- Yi Jing Eric Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20250118681
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112135
- Publication date Apr 3, 2025
- NEXPERIA B.V.
- Yuet Keung Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER
- Publication number 20250112047
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Chandra Sekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH STEPPED CONDUCTIVE TERMINALS
- Publication number 20250112133
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...
- Publication number 20250112141
- Publication date Apr 3, 2025
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETW...
- Publication number 20250105108
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Stefan MACHEINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PA...
- Publication number 20250105206
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20250096017
- Publication date Mar 20, 2025
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...
- Publication number 20250087564
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...
- Publication number 20250087623
- Publication date Mar 13, 2025
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20250079386
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION
- Publication number 20250079247
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dummy SOP Within Saw Street
- Publication number 20250079372
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...
- Publication number 20250079225
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hajung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...
- Publication number 20250079273
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FAN-OUT PACKAGE
- Publication number 20250079427
- Publication date Mar 6, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250079248
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Myoungkyun Kil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC
- Publication number 20250079366
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

the devices being connected to a common substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor device with hollow interconnectors

Stacking structure, package structure and method of fabricating the...

Light emitting device

Assembly apparatus

Direct bonded stack structures for increased reliability and improv...

Flip-chip package assembly

Method for forming a semiconductor device including forming a first...

Package process and package structure

Light-emitting diode display panel with micro lens array

Mosaic focal plane array

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device with electromagnetic interference film and met...

Microelectronic assemblies having topside power delivery structures

Dummy structure of stacked and bonded semiconductor device

Integrated circuit structure

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Fluidic assembly encapsulating light emitting diodes

Package device

Semiconductor package having side wall plating

Laser-cut lead-frame for integrated circuit (IC) packages

Method of fabricating package

Multi-chip package with high density interconnects

Chip assembling on adhesion layer or dielectric layer, extending be...

Method for forming chip package structure with molding layer

Light emitting device, resin package, resin-molded body, and method...

Selective micro device transfer to receiver substrate

Multi-dimensional integrated circuits having semiconductors mounted...

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Patents Applicationslast 30 patents

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Inhibiting Creep of Underfill Ma...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER

PACKAGES WITH STEPPED CONDUCTIVE TERMINALS

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETW...

METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PA...

SELECTIVE LAYER TRANSFER

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...

LOW COST PACKAGE WARPAGE SOLUTION

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...

MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION

Semiconductor Device and Method of Forming Dummy SOP Within Saw Street

DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...

BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...

METHOD FOR FABRICATING FAN-OUT PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC