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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device with electromagnetic interference film and met...
Patent number
12,243,833
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Hsi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having topside power delivery structures
Patent number
12,243,828
Issue date
Mar 4, 2025
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy structure of stacked and bonded semiconductor device
Patent number
12,237,291
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure
Patent number
12,238,865
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
Patent number
12,237,245
Issue date
Feb 25, 2025
Altera Corporation
Loke Yip Foo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluidic assembly encapsulating light emitting diodes
Patent number
12,230,743
Issue date
Feb 18, 2025
ehux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package device
Patent number
12,230,558
Issue date
Feb 18, 2025
Innolux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having side wall plating
Patent number
12,224,232
Issue date
Feb 11, 2025
SILICONIX INCORPORATED
Barry Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
Patent number
12,224,181
Issue date
Feb 11, 2025
Texas Instruments Incorporated
Tiange Xie
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of fabricating package
Patent number
12,217,976
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-chip package with high density interconnects
Patent number
12,218,069
Issue date
Feb 4, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
12,218,098
Issue date
Feb 4, 2025
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming chip package structure with molding layer
Patent number
12,218,104
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Light emitting device, resin package, resin-molded body, and method...
Patent number
12,211,959
Issue date
Jan 28, 2025
Nichia Corporation
Hirofumi Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
12,199,058
Issue date
Jan 14, 2025
VueReal Inc.
Gholamreza Chaji
G01 - MEASURING TESTING
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Patent Grant
Multi-dimensional integrated circuits having semiconductors mounted...
Patent number
12,199,196
Issue date
Jan 14, 2025
GBT Tokenize Corp.
Danny Rittman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacture
Patent number
12,199,024
Issue date
Jan 14, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,191,251
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
Patent number
12,191,163
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaged semiconductor device having improved reliability and inspe...
Patent number
12,183,707
Issue date
Dec 31, 2024
STMicroelectronics S.r.l.
Agatino Minotti
H01 - BASIC ELECTRIC ELEMENTS
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Low cost package warpage solution
Patent number
12,183,596
Issue date
Dec 31, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
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Package structure having bridge structure for connection between se...
Patent number
12,183,681
Issue date
Dec 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonded structure with interconnect structure
Patent number
12,176,294
Issue date
Dec 24, 2024
Adeia Semiconductor Bonding Technologies, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
12,176,295
Issue date
Dec 24, 2024
Advanced Semiconductor Engineering, Inc.
Chao Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fabricating active-bridge-coupled GPU chiplets
Patent number
12,170,263
Issue date
Dec 17, 2024
Advanced Micro Devices, Inc.
Skyler J. Saleh
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
Patent number
12,165,986
Issue date
Dec 10, 2024
Amkor Technology Singapore Holding Pte Ltd.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Micro light emitting device array and method of manufacturing the s...
Patent number
12,166,021
Issue date
Dec 10, 2024
Samsung Electronics Co., Ltd.
Kyungwook Hwang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Single-shot encapsulation
Patent number
12,166,001
Issue date
Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
Patent number
12,159,862
Issue date
Dec 3, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
Patent number
12,154,940
Issue date
Nov 26, 2024
SARAS MICRO DEVICES, INC.
Richard P. Sheridan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
Publication number
20250069918
Publication date
Feb 27, 2025
Canon Kabushiki Kaisha
Byung-Jin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...
Publication number
20250069973
Publication date
Feb 27, 2025
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGING COMPONENT HAVING SIDE WETTABLE STRUCTURE
Publication number
20250069974
Publication date
Feb 27, 2025
PANJIT INTERNATIONAL INC.
CHUNG-HSIUNG HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
Publication number
20250062217
Publication date
Feb 20, 2025
NXP USA, Inc.
You Ge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20250062201
Publication date
Feb 20, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...
Publication number
20250062152
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
Hyungjun Kim
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250062286
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
Hyunsoo Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
Publication number
20250054831
Publication date
Feb 13, 2025
INFINEON TECHNOLOGIES AG
Chee Yang Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
Publication number
20250054879
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen Hsin Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, CHIP AND FABRICATION METHOD THEREOF, MEMORY S...
Publication number
20250054905
Publication date
Feb 13, 2025
Yangtze Memory Technologies Co., Ltd.
Ping Mo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
Publication number
20250056937
Publication date
Feb 13, 2025
Micron Technology, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20250054898
Publication date
Feb 13, 2025
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION
Publication number
20250054776
Publication date
Feb 13, 2025
Micron Technology, Inc.
Federico Pio
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
Publication number
20250046757
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20250046753
Publication date
Feb 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
Publication number
20250046750
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Youngja KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250029951
Publication date
Jan 23, 2025
Advanced Semiconductor Engineering, Inc.
Kay Stefan ESSIG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20250029929
Publication date
Jan 23, 2025
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
Publication number
20250030386
Publication date
Jan 23, 2025
Skyworks Solutions, Inc.
Weimin Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Methods of Manufacture
Publication number
20250022763
Publication date
Jan 16, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Sheng-Han Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Preparation Method of Chip Package Structure and Package Structure
Publication number
20250022827
Publication date
Jan 16, 2025
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd
Xiangang Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
Publication number
20250022774
Publication date
Jan 16, 2025
Altera Corporation
Loke Yip FOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20250015030
Publication date
Jan 9, 2025
VueReal Inc.
Gholamreza CHAJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250015043
Publication date
Jan 9, 2025
Samsung Electronics Co., Ltd.
Jaeean LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
Publication number
20250015021
Publication date
Jan 9, 2025
SHANGHAI METAPWR ELECTRONICS CO., LTD
Jianhong ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
Publication number
20250015002
Publication date
Jan 9, 2025
AOI ELECTRONICS CO., LTD.
Yoichiro KURITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
Publication number
20250006689
Publication date
Jan 2, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
Publication number
20250006596
Publication date
Jan 2, 2025
NXP USA, Inc.
You Ge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
Publication number
20250006510
Publication date
Jan 2, 2025
TEXAS INSTRUMENTS INCORPORATED
Yu Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250006577
Publication date
Jan 2, 2025
Innolux Corporation
Mei-Yen Chen
H01 - BASIC ELECTRIC ELEMENTS