the devices being connected to a common substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/97the devices being connected to a common substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Optical lithography system and method of using the same
- Patent number 11,960,211
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,948,862
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,403
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact opto-electronic modules and fabrication methods for such mo...
- Patent number 11,942,580
- Issue date Mar 26, 2024
- ams Sensors Singapore Pte. Ltd.
- Simon Gubser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical chips mounted on a deformed carrier
- Patent number 11,942,572
- Issue date Mar 26, 2024
- OSRAM OLED GmbH
- Siegfried Herrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead package with wettable flanges
- Patent number 11,935,821
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
- Patent number 11,935,771
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Randy A. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,935,878
- Issue date Mar 19, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,929,308
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive thermal management architecture for electronic devices
- Patent number 11,929,297
- Issue date Mar 12, 2024
- Hamilton Sundstrand Corporation
- Hebri Vijayendra Nayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed exposure for large die
- Patent number 11,929,347
- Issue date Mar 12, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including mold layer and manufacturing method...
- Patent number 11,923,340
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing side wettable package
- Patent number 11,916,030
- Issue date Feb 27, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,916,059
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 11,908,802
- Issue date Feb 20, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for collectively bending microelectronic components using s...
- Patent number 11,908,832
- Issue date Feb 20, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Alexis Rochas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240128157
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
- Publication number 20240128185
- Publication date Apr 18, 2024
- PANJIT INTERNATIONAL INC.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20240128171
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Junwoo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240113072
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
- Publication number 20240113070
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- CHINTAN BUCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240105632
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105701
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088048
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGE STRUCTURE
- Publication number 20240088091
- Publication date Mar 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20240087914
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Structures for Integrated Circuit Package
- Publication number 20240079324
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240079356
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071947
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...
- Publication number 20240071949
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240072021
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20240063177
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
- Publication number 20240063167
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240063163
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS

the devices being connected to a common substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical lithography system and method of using the same

Semiconductor package and manufacturing method thereof

Semiconductor device and method of making a wafer-level chip-scale...

Devices and methods related to dual-sided radio-frequency package w...

Direct bonded stack structures for increased reliability and improv...

Package stacking using chip to wafer bonding

Regulator circuit package techniques

Flip chip packaged devices with thermal pad

Advanced info POP and method of forming thereof

Semiconductor device and manufacturing method thereof

Semiconductor package including high thermal conductivity layer

Package structures and method of forming the same

Integrated circuit package and method

Compact opto-electronic modules and fabrication methods for such mo...

Optical chips mounted on a deformed carrier

Quad flat no-lead package with wettable flanges

Modular mainframe layout for supporting multiple semiconductor proc...

Package structure and method for manufacturing the same

Method for manufacturing leadless semiconductor package with wettab...

Method for packaging an integrated circuit (IC) package with embedd...

Flip chip package assembly

Conductive thermal management architecture for electronic devices

Mixed exposure for large die

Semiconductor package including mold layer and manufacturing method...

Method for manufacturing side wettable package

Electronic device

Thermal interface material having different thicknesses in packages

Semiconductor package with solder standoff

Multi-chip package with high density interconnects

Process for collectively bending microelectronic components using s...

Patents Applicationslast 30 patents

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...

Method for Forming a Semiconductor Device Having TSV Formed Through...

Semiconductor Device and Method of Stacking Hybrid Substrates with...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING A PACKAGE STRUCTURE

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Redistribution Layer Structures for Integrated Circuit Package

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

Die Structures and Methods of Forming the Same

CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE AND METHOD

TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...

METHOD FOR MAKING ELECTRONIC PACKAGE

3DIC Package and Method Forming the Same

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

Semiconductor Device and Method of Forming the Same

SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME