the devices being of a type provided for in group H01L31/00

Industry

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H01L25/041

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/041the devices being of a type provided for in group H01L31/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,264,358
- Issue date Mar 1, 2022
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 11,257,964
- Issue date Feb 22, 2022
- KINGPAK TECHNOLOGY INC.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for electrical connection of micro-devices a...
- Patent number 11,024,608
- Issue date Jun 1, 2021
- X Display Company Technology Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS compatible material platform for photonic integrated circuits
- Patent number 10,935,722
- Issue date Mar 2, 2021
- Dong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithically integrated photodetector and receiver
- Patent number 10,431,707
- Issue date Oct 1, 2019
- Hewlett Packard Enterprise Development LP
- Cheng Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated optical sensor module
- Patent number 9,716,193
- Issue date Jul 25, 2017
- Analog Devices, Inc.
- Dipak Sengupta
- G02 - OPTICS
Information Patent Grant
Cavity-down pressure sensor device
- Patent number 9,638,596
- Issue date May 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a radiation imaging panel comprising imagi...
- Patent number 8,850,697
- Issue date Oct 7, 2014
- Oy Ajat LTD
- Konstantinos Spartiotis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a radiation imaging panel comprising imagi...
- Patent number 8,117,741
- Issue date Feb 21, 2012
- Oy Ajat LTD
- Konstantinos Spartiotis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Photovoltaic module and the use thereof
- Patent number 7,977,567
- Issue date Jul 12, 2011
- Fraunhofer-Gesellschaft zur Forderung Angewandten Forschung E.V.
- Andreas Bett
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 7,238,968
- Issue date Jul 3, 2007
- Josuke Nakata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Flexible substrate, semiconductor device, imaging device, radiation...
- Patent number 6,909,173
- Issue date Jun 21, 2005
- Canon Kabushiki Kaisha
- Osamu Hamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Clear plastic packaging in a CMOS active pixel image sensor
- Patent number 6,740,870
- Issue date May 25, 2004
- Micron Technology, Inc.
- Nicholas A. Doudoumopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact detection device for a gamma camera
- Patent number 6,717,149
- Issue date Apr 6, 2004
- Commissariat a l'Energie Atomique
- Olivier Monnet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro gamma camera with semiconducting detectors
- Patent number 6,465,790
- Issue date Oct 15, 2002
- Commissariat a l'Energie Atomique
- Olivier Monnet
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20240213215
- Publication date Jun 27, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20220139876
- Publication date May 5, 2022
- Google LLC
- Woon-Seong Kwon
- G02 - OPTICS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20210288190
- Publication date Sep 16, 2021
- Kingpak Technology Inc.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS Compatible Material Platform for Photonic Integrated Circuits
- Publication number 20210080648
- Publication date Mar 18, 2021
- Dong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR ELECTRICAL CONNECTION OF MICRO-DEVICES A...
- Publication number 20180323178
- Publication date Nov 8, 2018
- X-Celeprint Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED PHOTODETECTOR AND RECEIVER
- Publication number 20180097139
- Publication date Apr 5, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Cheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140374870
- Publication date Dec 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGI...
- Publication number 20120090171
- Publication date Apr 19, 2012
- OY AJAT, LTD.
- Konstantinos SPARTIOTIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSLUCENT COVER FOR SOLAR CELLS
- Publication number 20110168240
- Publication date Jul 14, 2011
- Earl David Forrest
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGI...
- Publication number 20100255629
- Publication date Oct 7, 2010
- Konstantinos SPARTIOTIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, AN ASSEMBLY PROCESS, AND AN ASSEMBLY APPARATUS
- Publication number 20100218805
- Publication date Sep 2, 2010
- THE AUSTRALIAN NATIONAL UNIVERSITY
- Vernie Allan Everett
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PHOTOVOLTAIC MODULE AND THE USE THEREOF
- Publication number 20090272427
- Publication date Nov 5, 2009
- Andreas Bett
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of its manufacture
- Publication number 20050067622
- Publication date Mar 31, 2005
- Josuke Nakata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flexible substrate, semiconductor device, imaging device, radiation...
- Publication number 20020195676
- Publication date Dec 26, 2002
- Canon Kabushiki Kaisha
- Osamu Hamamoto
- G01 - MEASURING TESTING

the devices being of a type provided for in group H01L31/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

ASIC package with photonics and vertical power delivery

ASIC package with photonics and vertical power delivery

Sensor package structure

Structures and methods for electrical connection of micro-devices a...

CMOS compatible material platform for photonic integrated circuits

Monolithically integrated photodetector and receiver

Integrated optical sensor module

Cavity-down pressure sensor device

Method for manufacturing a radiation imaging panel comprising imagi...

Method for manufacturing a radiation imaging panel comprising imagi...

Photovoltaic module and the use thereof

Semiconductor device and method of making the same

Flexible substrate, semiconductor device, imaging device, radiation...

Clear plastic packaging in a CMOS active pixel image sensor

Compact detection device for a gamma camera

Micro gamma camera with semiconducting detectors

Patents Applicationslast 30 patents

Asic Package With Photonics And Vertical Power Delivery

Asic Package With Photonics And Vertical Power Delivery

SENSOR PACKAGE STRUCTURE

CMOS Compatible Material Platform for Photonic Integrated Circuits

STRUCTURES AND METHODS FOR ELECTRICAL CONNECTION OF MICRO-DEVICES A...

MONOLITHICALLY INTEGRATED PHOTODETECTOR AND RECEIVER

IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGI...

TRANSLUCENT COVER FOR SOLAR CELLS

METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGI...

SUBSTRATE, AN ASSEMBLY PROCESS, AND AN ASSEMBLY APPARATUS

PHOTOVOLTAIC MODULE AND THE USE THEREOF

Semiconductor device and method of its manufacture

Flexible substrate, semiconductor device, imaging device, radiation...